Hydrothermal characterization of metal foam-cladded pin fin array heat sink

Date

2024-4

Author

Güler, Nursel

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The advancement of technology has given rise to a growing demand for effective cooling solutions for electronic components. Heat sinks are commonly used for dissipating heat from electronic components to the environment. Along with the developing technology, the cooling capacity of the heat sinks such as pin fin or plate fin heat sinks has become insufficient. Therefore, a need for advanced cooling methods has emerged. Open-cell metal foams are a fascinating class of materials that combine the structural properties of metals with the unique characteristics of foams. They are lightweight, strong, and have high heat transfer area to volume ratio. The aim of this thesis is investigating the heat transfer performance and pressure drop chraracteristics of a novel geometry by cladding aluminum foam onto the outer surface of pin fins on heat sink. In order to validate the numerical model, series of experiments are conducted. After the validation of the numerical model, a metric which is called as performance evaluation criterion (PEC) is used to compare the performances of different Pores Per Inch (PPI) valued aluminum foams. After validating the numerical model, a parametric analysis is performed to see the effects of different foam cladding thicknesses and porosity on heat transfer performance and pressure drop. All of the studied cases show an enhancement in hydrothermal performance. Among the studied geometries at most 46.5% and at least 37.5% increase in hydrothermal performance compared to the base case is observed.

Subject Keywords

Cooling of electronic components, Heat sinks, Open-cell metal foam, Metal foam cladded pin fin

URI

https://hdl.handle.net/11511/109493

Collections

Graduate School of Natural and Applied Sciences, Thesis