Circuit design and technology evaluation of front-end RFIC’s for wireless communication

2024-9-03
İnce, Yağız Mahmut
With the explosive demand for wireless-capable devices supporting a variety of data types such as audio, graphics, and video, the expectations for wireless communication technologies are increasing. Current bulk-CMOS technologies are insufficient for the evolving needs of front-end wireless communication systems, leading to a shift from discrete components to integrated circuits (ICs). III-V semiconductor technologies, such as the GaAs process, are favored in radio frequency integrated circuits (RFICs) due to their superior electron mobility, isolation, and noise characteristics, as well as higher carrier mobilities and transition frequencies (fT). These advantages make GaAs circuitry ideal for wideband high-performance wireless communication systems. However, RF SOI CMOS has recently emerged as a potential challenger to GaAs, offering significant RF performance improvements over bulk-CMOS, such as higher fT and better isolation, while retaining CMOS advantages. This master thesis conducts a comparative analysis of receivers in front-end wireless communication devices, such as low noise amplifiers (LNAs) and RF switches, between GaAs and RF SOI CMOS technologies. The objective is to evaluate the potential of RF SOI CMOS to replace GaAs in wideband high-performance communication systems, thereby enabling SoC solutions for high-performance wireless systems.
Citation Formats
Y. M. İnce, “Circuit design and technology evaluation of front-end RFIC’s for wireless communication,” M.S. - Master of Science, Middle East Technical University, 2024.