A comparative study on analytical modelling of bondwires for power amplifier design applications

Date

2024-11-29

Author

Sedef, Uğur

Metadata

Show full item record

This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

Item Usage Stats

57
views

55
downloads

Cite This

Accurate modeling of bond-wires is crucial for optimizing circuit performance. This thesis evaluates eight analytical models considering geometry- and frequency-dependent characteristics, such as inductance, resistance, and capacitance to the ground plane. Starting with DC resistance and inductance, frequency effects and capacitance are sequentially included, culminating in models addressing grounding effects. Lumped element values from each model were validated against analytical calculations and ANSYS-Q3D results, achieving errors below 5% for inductance and resistance and under 15% for capacitance. The comprehensive models, Model-3 (accounting for DC resistance, inductance, mutual inductance, and capacitance) and Model-6 (including frequency and grounding effects), were further validated against HFSS simulations. As complexity increased, the models aligned more closely with HFSS, particularly at higher frequencies. Model-6 proved suitable for bond-wire analysis in power amplifiers, specifically for connections between a die transistor and another substrate. It was integrated with an 8-11 GHz MMIC PA (output power: 43 dBm) and evaluated in four configurations: two single-wire cases of varying lengths and two double-wire cases with shorter and longer wires. For single-wire cases, Model-6 showed a maximum discrepancy of 0.4 dB in output power compared to HFSS, with gain and power-added efficiency (PAE) differences below 0.4 dB and 5%, respectively. Double-wire configurations, with reduced inductance, achieved impedance closer to 50 ohms, yielding output power differences under 0.3 dB and gain and PAE deviations of 0.2 dB and 4%. Implemented in MATLAB, the model enabled rapid predictions and iterative design optimization, outperforming time-intensive 3D simulations. These results highlight Model-6’s efficacy in analyzing and optimizing bond-wire effects in RF power amplifiers.

Subject Keywords

Bond-wire, Lumped element, Analytical model, Inductance, Hfss

URI

https://hdl.handle.net/11511/112959

Collections

Graduate School of Natural and Applied Sciences, Thesis