Design and optimization of die on printed circuit board for e-band low noise amplifiers

2024-12
Kaplan, Faruk
This thesis focuses on the optimization of die-on printed circuit board (PCB) design for low noise amplifiers (LNA) operating in the extremely high frequency (EHF) band. This frequency band improves the range resolution and accuracy, helping to distinguish near objects. Collision sensors in automotive applications and incoming missile identification systems in military applications utilize the EHF band. The thesis investigates various techniques to enhance performance metrics, such as noise figure (NF) and scattering (S) parameters. The methodology covers a comprehensive literature survey, analytical derivations, and computer simulations using Ansys High-Frequency Structure Simulator (HFSS). Microstrip and coplanar lines, via distribution, wire bond parameters, and compensation configurations, are explored with the aid of HFSS. The thesis hypothesizes that optimizing wire bonds and distributed matching improves S parameters and NF. Also, the mismatch is compensated with capacitive and inductive sections. A hybrid model employing W-elements with discontinuity and mutual capacitance models is studied to decrease the simulation time for matching. After achieving sufficient overlap between the two models, the length and width of matching sections are optimized by using Particle Swarm Optimization (PSO) for different numbers of stages. Simultaneously, experimental validation is conducted through the manufacturing of test PCBs using a network analyzer tool. In conclusion, this research examines die-on-PCB design optimization for E-band LNAs, incorporating methodological perspectives. The findings have implications for the development of EHF systems and contribute to the field of RF engineering.
Citation Formats
F. Kaplan, “Design and optimization of die on printed circuit board for e-band low noise amplifiers,” M.S. - Master of Science, Middle East Technical University, 2024.