Causal RL Prediction of Fine-Pitch Interconnects Using Neural Networks

Date

2024-01-01

Author

Ünal, Hasan Said
Durgun, Ahmet Cemal

Metadata

Show full item record

This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

Item Usage Stats

9
views

0
downloads

In this study, we compare physics-aware neural networks for modeling fine-pitch interconnects. Results show a 5-fold reduction in test loss when imposing DC resistance through analytical equations and preserving the causality relation between resistance and inductance.

Subject Keywords

causal RLGC parameters, fine pitch interconnect, neural network

URI

https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85212710769&origin=inward
https://hdl.handle.net/11511/113181

DOI

https://doi.org/10.1109/epeps61853.2024.10754313

Conference Name

33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024

Collections

Department of Electrical and Electronics Engineering, Conference / Seminar

Citation Formats

H. S. Ünal and A. C. Durgun, “Causal RL Prediction of Fine-Pitch Interconnects Using Neural Networks,” presented at the 33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024, Toronto, Kanada, 2024, Accessed: 00, 2025. [Online]. Available: https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85212710769&origin=inward.