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Low-Temperature Au-In TLP Bonding for Compact Hermetic Packaging of Piezoelectric MEMS Devices
Date
2025-06-29
Author
Balcı, Leman Dicle
Atik, Ali Can
Yüksel, Muhammed Berat
Külah, Haluk
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This work is licensed under a
Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License
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URI
https://hdl.handle.net/11511/115772
Conference Name
Transducers 2025
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Department of Electrical and Electronics Engineering, Conference / Seminar
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L. D. Balcı, A. C. Atik, M. B. Yüksel, and H. Külah, “Low-Temperature Au-In TLP Bonding for Compact Hermetic Packaging of Piezoelectric MEMS Devices,” presented at the Transducers 2025, Florida, Amerika Birleşik Devletleri, 2025, Accessed: 00, 2025. [Online]. Available: https://hdl.handle.net/11511/115772.
