Uniform deposition of large-area graphene films on copper using low-pressure chemical vapor deposition technique

2022-05-01
Gürsoy, Mehmet
Citak, Emre
Karaman, Mustafa
Large-area graphene of the order of centimeters was deposited on copper substrates by low-pressure chemical vapor deposition (LPCVD) using hexane as the carbon source. The effect of temperature and the carrier gas flowrates on the quality and uniformity of the as-deposited graphene was investigated using the Raman analysis. The film deposited at 870 degrees C with a total carrier gas flowrate of 50 sccm is predominantly single-layer with very low defects according to the Raman spectra. The 2D/G peak intensity ratios obtained from the Raman spectra of samples from three different locations of graphene deposited on a whole copper catalyst was used to calculate the large-area uniformity. Based on the results, a very high uniformity of 89.6% was calculated for the graphene deposited at 870 degrees C. The uniformity was observed to decrease with increasing temperature. Similar to the thickness uniformity, the electrical conductivity values obtained as a result of I-V measurements and water contact angle measurements were found to be close to each other for the graphene deposited under the same deposition conditions.
CARBON LETTERS
Citation Formats
M. Gürsoy, E. Citak, and M. Karaman, “Uniform deposition of large-area graphene films on copper using low-pressure chemical vapor deposition technique,” CARBON LETTERS, vol. 32, no. 3, pp. 781–787, 2022, Accessed: 00, 2025. [Online]. Available: https://hdl.handle.net/11511/116350.