Experimental study of spray cooling of electronics over high heat fluxed surface

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2013
Balıkçı, Çağrı
Due to need for more powerful and rapider electron transformation requirements, electronic packages are getting denser. Unluckily, capability of transferring more electrons is also increased. As a result, especially recent semiconductor packages suffer from high heat fluxes, which can cause performance degradation and even burnt chips. For all of those reasons, an efficient and low thermal resistant heat transfer regime has to be applied onto those electronic components. Spray cooling for electronics is one of the best cures for this type of problems. Spray cooling utilizes latent heat of vaporization and pulverization of fluid particles so that large amount of heat can be rejected almost at constant temperature with small flow rates. In this study factors that affecting spray cooling for electronics performance, such as inclination angle, fluid type, mass flow rate and pressure difference, will be investigated by experimentally by using commercial dielectric fluids. At the end of the study, results will be compared with similar studies and empirical models.