Tayfun Akın

Department of Electrical and Electronics Engineering
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Interband optical absorption obtained by pseudopotential method for type-II InAs/GaSb SL photodetectors
Akel, Kazim; HOŞTUT, MUSTAFA; Akın, Tayfun; Ergun, Yuksel (2021-05-01)
We have calculated interband optical absorption for InAs/GaSb based type-II superlattice (SL) structures. The empirical pseudopotential method (EPM) has been used as an alternative to the k.p method since it is less sophis...
An all-silicon process platfom for wafer-level vacuum packaged MEMS devices
Torunbalci, Mustafa Mert; Gavcar, Hasan Dogan; Yesil, Ferhat; Alper, Said Emre; Akın, Tayfun (2021-01-01)
IEEEThis paper introduces a novel, inherently simple, and all-silicon wafer-level fabrication and hermetic packaging method developed for MEMS devices. The proposed method uses two separate SOI wafers to form highly-doped ...
Realization of Single Layer Microbolometer Detector Pixel Using ZnO Material
Tanrikulu, M. Yusuf; Yildizak, Cigdem; Okyay, Ali K.; Akar, Orhan; Sarac, Adem; Akın, Tayfun (Institute of Electrical and Electronics Engineers (IEEE), 2020-09-01)
This paper presents the realization of a single layer microbolometer pixel fabricated using only ZnO material coated with atomic layer deposition. Due to the stress-free nature and high temperature coefficient of resistanc...
Low-Cost LWIR-Band CMOS Infrared (CIR) Microbolometers for High Volume Applications
Akın, Tayfun (2020-01-01)
This paper provides an overview of the studies and the current status for the development of a novel, low-cost, and CMOS foundry compatible approach for implementing microbolometers with standard CMOS and simple post-CMOS ...
Aydemir, Akin; Akın, Tayfun (2020-01-01)
This paper presents the design, fabrication, and characterization of a self-packaged three axis capacitive MEMS accelerometer fabricated by using only four masks that is capable of differentially sensing the externally app...
Resonance-Based Temperature Sensors using a Wafer Level Vacuum Packaged SOI MEMS Process
Aydın, Gülşah Demirhan; Akın, Tayfun (VBRI Press AB, 2020-01-01)
This paper reports the development of resonance-based temperature sensors using a wafer level vacuum packaged SOI MEMS process which is normally used to implement various MEMS sensors, including MEMS gyroscopes and acceler...
Wafer-Level Low-Temperature Solid-Liquid Inter-Diffusion Bonding With Thin Au-Sn Layers for MEMS Encapsulation
Temel, Oguzhan; Kalay, Yunus Eren; Akın, Tayfun (Institute of Electrical and Electronics Engineers (IEEE), 2020-01-01)
IEEEA novel solid-liquid inter-diffusion (SLID) bonding process is developed allowing to use thin layers of the Au-Sn material in wafer-level microelectromechanical systems (MEMS) packaging while providing a good bonding s...
Development and Modeling of a Wafer-Level BCB Packaging Method for Capacitive RF MEMS Switches
Comart, Ilker; Cetintepe, Cagri; Sagiroglu, Ebru; Demir, Şimşek; Akın, Tayfun (2019-08-01)
This paper presents a novel wafer-level packaging method for shunt, capacitive RF MEMS switches using BCB as the adhesive interlayer. Fabrication and electrical characteristics of the proposed package were initially evalua...
The detailed analysis of wavefunction overlaps for InAs/AlSb/GaSb based N-structure type-II SL pin photodetectors
Hostut, M.; Tansel, T.; Kilic, A.; Akın, Tayfun; Ergun, Y. (2019-07-01)
We report on a detailed analysis of electron and hole wave functions with their overlap integrals for InAs/AlSb/GaSb based N-structure type-II superlattice (T2SL) pin detectors under applied reverse bias. Bandgap energies ...
Numerical and Experimental Investigation into LWIR Transmission Performance of Complementary Silicon Subwavelength Antireflection Grating (SWARG) Structures
Cetin, Ramazan; Akın, Tayfun (Springer Science and Business Media LLC, 2019-03-18)
This paper presents a detailed comparison between the long wave infrared (LWIR) transmission performances of binary, silicon based, structurally complementary pillar and groove type antireflective gratings that can be used...
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