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Tayfun Akın
E-mail
tayfuna@metu.edu.tr
Department
Department of Electrical and Electronics Engineering
ORCID
0000-0001-8275-8146
Scopus Author ID
7004435753
Web of Science Researcher ID
O-6924-2015
Publications
Theses Advised
Open Courses
Projects
Tuning structural, electrical, and THz optical properties of VxOy films with W-doping
Atik, Bahar; Dirican, Emrah; Demirors, Oytun; Altan, Hakan; Esentürk, Okan; Yildirim, Mustafa; Akın, Tayfun (2022-05-01)
Vanadium oxide plays a crucial role as the temperature-sensitive layer of microbolometers. This layer should possess a high temperature coefficient of resistance (TCR) along with a desirable resistivity suitable for readou...
Interband optical absorption obtained by pseudopotential method for type-II InAs/GaSb SL photodetectors
Akel, Kazim; Hoştut, Mustafa ; Akın, Tayfun; Ergun, Yuksel (2021-05-01)
We have calculated interband optical absorption for InAs/GaSb based type-II superlattice (SL) structures. The empirical pseudopotential method (EPM) has been used as an alternative to the k.p method since it is less sophis...
An all-silicon process platfom for wafer-level vacuum packaged MEMS devices
Torunbalci, Mustafa Mert; Gavcar, Hasan Dogan; Yesil, Ferhat; Alper, Said Emre; Akın, Tayfun (2021-01-01)
This paper introduces a novel, inherently simple, and all-silicon wafer-level fabrication and hermetic packaging method developed for MEMS devices. The proposed method uses two separate SOI wafers to form highly-doped thro...
Investigation of doped and undoped VOxfilms for terahertz microbolometer applications
Atik, Bahar; Dirican, Emrah; Demirörs, Oytun; Altan, Hakan; Esentürk, Okan; Ylldlrlm, Mustafa; Akın, Tayfun (2021-01-01)
The microbolometer technology has proved its potential in the Infrared (IR) region due to its low fabrication costs, and room temperature operation, making this technology desirable to be used in various applications, and ...
Optimization of a microbolometer pixel for operation in the sub-1 THz region
Demirörs, Oytun; Atik, Bahar; Dirican, Emrah; Altan, Hakan; Esentürk, Okan; Ylldlrlm, Mustafa; Akın, Tayfun (2021-01-01)
Imaging in the Terahertz (THz) region has drawn attention in recent years, but the nature of the THz frequency regime causes some drawbacks in imaging such as long wavelength, high cost, and low emission levels at room tem...
Realization of Single Layer Microbolometer Detector Pixel Using ZnO Material
Tanrikulu, M. Yusuf; Yildizak, Cigdem; Okyay, Ali K.; Akar, Orhan; Sarac, Adem; Akın, Tayfun (Institute of Electrical and Electronics Engineers (IEEE), 2020-09-01)
This paper presents the realization of a single layer microbolometer pixel fabricated using only ZnO material coated with atomic layer deposition. Due to the stress-free nature and high temperature coefficient of resistanc...
Wafer-Level Low-Temperature Solid-Liquid Inter-Diffusion Bonding With Thin Au-Sn Layers for MEMS Encapsulation
Temel, Oguzhan; Kalay, Yunus Eren; Akın, Tayfun (Institute of Electrical and Electronics Engineers (IEEE), 2020-01-01)
IEEEA novel solid-liquid inter-diffusion (SLID) bonding process is developed allowing to use thin layers of the Au-Sn material in wafer-level microelectromechanical systems (MEMS) packaging while providing a good bonding s...
Resonance-Based Temperature Sensors using a Wafer Level Vacuum Packaged SOI MEMS Process
Aydın, Gülşah Demirhan; Akın, Tayfun (VBRI Press AB, 2020-01-01)
This paper reports the development of resonance-based temperature sensors using a wafer level vacuum packaged SOI MEMS process which is normally used to implement various MEMS sensors, including MEMS gyroscopes and acceler...
Low-Cost LWIR-Band CMOS Infrared (CIR) Microbolometers for High Volume Applications
Akın, Tayfun (2020-01-01)
This paper provides an overview of the studies and the current status for the development of a novel, low-cost, and CMOS foundry compatible approach for implementing microbolometers with standard CMOS and simple post-CMOS ...
SELF-PACKAGED THREE AXIS CAPACITIVE MEMS ACCELEROMETER
Aydemir, Akin; Akın, Tayfun (2020-01-01)
This paper presents the design, fabrication, and characterization of a self-packaged three axis capacitive MEMS accelerometer fabricated by using only four masks that is capable of differentially sensing the externally app...
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