Analyzing of usage of complex-shaped Cu-W parts produced by metal injection molding process for heat sink for high-performance electronic devices

Download
2019
Atak, Alper
During the past decades, the rapid evolution of electronic and information technology has resulted in a significant increase in the performance of the processors of the electronic devices. In order to dissipate the heat generated at the interface of these electronic devices, heat spreaders or heat sinks should be produced from suitable materials. Thermal conductivity and coefficient of thermal expansion(CTE) are two important thermal properties to consider for choosing the suitable materials for this process. Aluminum and copper have high thermal conductivity values, but their high CTE values result in warping of the plate, crack for ceramic component or solder fatigue because of the large difference of CTE to ceramics or silicon. Copper-Tungsten (CuW) composites, which combines high thermal coefficient value with matched CTE value are used to overcome these problems. Since copper and tungsten are not mutually soluble, CuW parts are produced by powder metallurgy techniques. Metal injection molding (MIM) is a powder metallurgy technique which enables complex parts to be formed as easily as simple geometries, thereby allowing increased design freedom. The aim of this thesis is to produce Complex-Shaped CuW parts with necessary thermal properties by using MIM process.

Suggestions

Numerical Investigation on Cooling of Small form Factor Computer Cases
ORHAN, OMER EMRE; Tarı, İlker (2008-11-01)
In this study, cooling of small form factor computers is numerically investigated. The problem is a conjugate heat transfer problem in which ambient air is the final heat transfer medium. In modeling the problem, heat transfer using heat pipes running from the CPU to the heat exchanger in the back end of the chassis, forced convection inside the chassis, ventilation of the chassis air, conduction paths inside the chassis, and natural convection from the chassis walls to the ambient air are considered. The n...
Three phase Inverter Speed Control of AC Drives Motor using DSPic microcontroller
Dida, A. Hadj; Bourahla, M.; Ertan, Hulusi Bülent; Benghanem, M.; Benzina, M. E. (2015-09-04)
AC drives based on full digital control have reached the status of a maturing technology in a broad range of applications, ranging from low-cost to high performance systems. In the field of the drive of the electric machines, the elimination of the mechanical speed sensor can present an economic interest and improve safety of operation. With speed estimation, sensorless vector control is possible, meaning that the speed of induction machines without mechanical speed sensors can be controlled. The flux obser...
Analysis and evaluation of HFO2 based resistive RAM devices for new generation non-volatile memories
Tekin, Serdar Burhan; Bek, Alpan; Kalem, Şeref; Department of Micro and Nanotechnology (2018)
The objective of this thesis is to investigate the most suitable embedded non-volatile memory (eNVM) cell for the 28 nm and below CMOS technology. HfO2 based resistive RAM (RRAM) memories are one of the most important candidates for new generation eNVMs due to their compatibility, reliability, low power consumption and high speed operation. In the scope of this thesis, several HfO2 based memory stacks were built and characterized by optical and electrical characterization methods. Raman and X-Ray diffractio...
Comparison of the thermal and pressure drop characteristics of a conventional fin block and partially metal foam embedded heat sinks
Ataer, Süleyman Kaancan; Yamalı, Cemil; Albayrak, Kahraman; Department of Mechanical Engineering (2014)
Despite the downsizing of the electronic components, the increase in the power consumption of the electronic components and correspondingly the rise in the loss of power that transforms into heat have given a momentum in the search for different cooling methods for thermal sinks by the thermal engineers. Excessively heated regions that form on the small areas where the heat generating components contact the heat sinks create a thermal resistance for the heat flow from the surface of the component to the cha...
Design and simulation of a vapor compression refrigeration cycle for a micro refrigerator
Yıldız, Seyfettin; Okutucu Özyurt, Hanife Tuba; Department of Mechanical Engineering (2010)
Cooling of electronic equipments has become an important issue as the advances in technology enabled the fabrication of very small devices. The main challenge in cooling is the space limitation. The use of miniature refrigerators seems to be a solution alternative for the cooling problem. The objective of this study is to design and simulate a vapor compression refrigeration cycle for a micro-scale refrigerator. A MATLAB code is developed for the simulations. The four components of the refrigerator, namely,...
Citation Formats
A. Atak, “Analyzing of usage of complex-shaped Cu-W parts produced by metal injection molding process for heat sink for high-performance electronic devices,” Thesis (M.S.) -- Graduate School of Natural and Applied Sciences. Metallurgical and Materials Engineering., Middle East Technical University, 2019.