Analyzing of usage of complex-shaped Cu-W parts produced by metal injection molding process for heat sink for high-performance electronic devices

Atak, Alper
During the past decades, the rapid evolution of electronic and information technology has resulted in a significant increase in the performance of the processors of the electronic devices. In order to dissipate the heat generated at the interface of these electronic devices, heat spreaders or heat sinks should be produced from suitable materials. Thermal conductivity and coefficient of thermal expansion(CTE) are two important thermal properties to consider for choosing the suitable materials for this process. Aluminum and copper have high thermal conductivity values, but their high CTE values result in warping of the plate, crack for ceramic component or solder fatigue because of the large difference of CTE to ceramics or silicon. Copper-Tungsten (CuW) composites, which combines high thermal coefficient value with matched CTE value are used to overcome these problems. Since copper and tungsten are not mutually soluble, CuW parts are produced by powder metallurgy techniques. Metal injection molding (MIM) is a powder metallurgy technique which enables complex parts to be formed as easily as simple geometries, thereby allowing increased design freedom. The aim of this thesis is to produce Complex-Shaped CuW parts with necessary thermal properties by using MIM process.