Show/Hide Menu
Hide/Show Apps
Logout
Türkçe
Türkçe
Search
Search
Login
Login
OpenMETU
OpenMETU
About
About
Open Science Policy
Open Science Policy
Communities & Collections
Communities & Collections
Help
Help
Frequently Asked Questions
Frequently Asked Questions
Guides
Guides
Thesis submission
Thesis submission
MS without thesis term project submission
MS without thesis term project submission
Publication submission with DOI
Publication submission with DOI
Publication submission
Publication submission
Supporting Information
Supporting Information
General Information
General Information
Copyright, Embargo and License
Copyright, Embargo and License
Contact us
Contact us
Scalar Measurement of Electromagnetic Shielding Efficiency of Carbon Textiles
Date
2010-12-10
Author
Terzioglu, Yunus
Metadata
Show full item record
This work is licensed under a
Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License
.
Item Usage Stats
93
views
0
downloads
Cite This
Electromagnetic shielding textiles are growing materials which indeed has numerous fields of applications today in tasks like increasing the safety of airborne systems, protection of electronic identifiers, protection suits for high voltage line workers and so on. This paper is focused on Electromagnetic Shielding Efficiency of carbon textile samples while illustrating a measurement principle and some basic information on shielding textiles.
Subject Keywords
Carbon textile
,
Efficiency
,
ESE
,
Measurement
,
Shielding
URI
https://hdl.handle.net/11511/63890
Collections
Department of Electrical and Electronics Engineering, Conference / Seminar
Suggestions
OpenMETU
Core
Nonlinear compressible finite viscoleasticity of epoxy-based polymers
Dal, Hüsnü; Gromala, P. J.; Han, B. (2019-01-01)
Epoxy-based polymers are widely used in the semiconductor industry as thermal and/or electrical interfaces and as encapsulating material. In the automotive industry, epoxy-based molding compounds (EMCs) are often used to protect not only the single IC packages but also the entire electronic control units (ECUs) (or the power modules). The stress caused by the mismatch of the coefficient of thermal expansion (CTE) between EMC and adjacent materials is one of the major causes for premature failure. In the tem...
Performance evaluation and comparison of low voltage grid-tied three-phase AC/DC converter configurations with SI and SIC semiconductor switches
Öztoprak, Oğuzhan; Hava, Ahmet Masum; Department of Electrical and Electronics Engineering (2019)
In this thesis, as compared to silicon IGBT (Si-IGBT) technology, the advantages of using higher efficiency and faster wide bandgap silicon carbide (SiC) semiconductor switches in low voltage three-phase grid-tied PWM DC/AC voltage source converters (VSCs) are investigated in terms of sizing, efficiency and economic considerations for MW-scale photovoltaic power plant applications. As the cost and energy efficiency of a VSC strongly affect the total system economics, this thesis proposes a design methodolog...
Mathematical modeling of adsorption/desorption systems for chemical heat pumps
Yurtsever, Ahmet Onur; Uludağ, Yusuf; Karakaş, Gürkan; Department of Chemical Engineering (2011)
Despite their limited commercial applications, chemical heat pumps (CHP) have been considered as an important alternative to conventional heating and cooling technologies. In this study, the adsorption-desorption of ethanol over activated carbon was applied on the CHP reactor. The ethanol vapor - activated carbon adsorption rate was determined at 30, 60, 90 and 120° experimentally by using Intelligent Gravimetric Analyzer C(IGA). The experimental adsorption data were used on the transient modeling of reacto...
Investigation of flow and heat transfer behavior of integrated pin fin-aluminum foam heat sink
ŞAHİN, Yiğit Serkan; TOPRAK, Beytullah İsmet; SOLMAZ, İsmail; Bayer, Özgür (2023-01-01)
With the rapid development in the electronics industry, the thermal management of high power density elec-tronic products (HPDEPs) has become very important and requires innovative heat removal technologies. In this study, an integrated heat sink (IHS) fabricated by combining aluminum foam and pin-finned heat sink config-urations that are frequently used in the cooling of electronic products has been proposed as an effective solution for the thermal management of HPDEPs. The heat removal and pressure drop c...
Thermal effects of gate connected field-plates and surface passivation on AlGaN/GaN HEMTs
Kara, Doğacan; Okutucu Özyurt, Hanife Tuba; Dönmezer, Nazlı; Department of Mechanical Engineering (2018)
AlGaN/GaN high electron mobility transistors (HEMTs) are widely preferred in automotive, space, and military applications due to their superior electrical and thermal properties. However, when operated in full capacity, their electrical reliability drops significantly due to electron collapse, device degradation, concentrated heating, and mechanical stresses. To increase the reliability and maximum performance of GaN HEMTs, field-plate and surface passivation technologies are used frequently. Although signi...
Citation Formats
IEEE
ACM
APA
CHICAGO
MLA
BibTeX
Y. Terzioglu, “Scalar Measurement of Electromagnetic Shielding Efficiency of Carbon Textiles,” 2010, p. 57, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/63890.