Pushing the Performance Envelop through Secondary Design Enhancements in Thermally Limited Compact Notebooks

Date

2015-10-02

Author

Khan, Muhammad Azhar Ali
Uzgoren, Eray
Muhtaroglu, Ali

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Thermal design enhancements in a thermally-limited, fixed-size compact notebook system are investigated in this paper. System temperature, power, and fan speed are characterized under a range of activity levels. A finite element model is developed, and validated against measurements. Design enhancements improve cooling with minimum intrusion to the existing mechanical design, and with no growth in size. A passive secondary heat pipe in the system reduces the CPU temperature by 5 degrees C, and improves the system performance through increased CPU + Graphics and Memory Controller Hub (GMCH) thermal design power (TDP) by 6.4%. When such a secondary heat pipe is considered with an integrated off-the shelf Peltier cooler module, the CPU temperature is only reduced by 2.3 degrees C and CPU+GMCH TDP is improved only by 4.9%. The results demonstrate a successful methodology to claim performance and/or energy efficiency improvement opportunity in an existing notebook box with minimum redesign effort.

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https://hdl.handle.net/11511/66534

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Engineering, Conference / Seminar

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Citation Formats

M. A. A. Khan, E. Uzgoren, and A. Muhtaroglu, “Pushing the Performance Envelop through Secondary Design Enhancements in Thermally Limited Compact Notebooks,” 2015, p. 0, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/66534.