A Novel HIS with a Perforated Ground Plane for Miniaturization and Bandwidth Enhancement

Date

2012-01-01

Author

Durgun, Ahmet Cemal
Balanis, Constantine A.
Birtcher, Craig R.

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This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

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Because of the design limitations of conventional high impedance surfaces (HIS), it is not possible to miniaturize the HIS and increase the bandwidth, simultaneously. To overcome this, a novel HIS is proposed with a periodically perforated ground plane. The magnetic flux flowing through the perforations results in an extra inductance which increases the fractional bandwidth and decreases the center frequency.

URI

https://hdl.handle.net/11511/69967

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Department of Electrical and Electronics Engineering, Conference / Seminar