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A Novel HIS with a Perforated Ground Plane for Miniaturization and Bandwidth Enhancement
Date
2012-01-01
Author
Durgun, Ahmet Cemal
Balanis, Constantine A.
Birtcher, Craig R.
Metadata
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Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License
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Because of the design limitations of conventional high impedance surfaces (HIS), it is not possible to miniaturize the HIS and increase the bandwidth, simultaneously. To overcome this, a novel HIS is proposed with a periodically perforated ground plane. The magnetic flux flowing through the perforations results in an extra inductance which increases the fractional bandwidth and decreases the center frequency.
URI
https://hdl.handle.net/11511/69967
DOI
https://doi.org/10.1109/aps.2012.6348841
Collections
Department of Electrical and Electronics Engineering, Conference / Seminar
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BibTeX
A. C. Durgun, C. A. Balanis, and C. R. Birtcher, “A Novel HIS with a Perforated Ground Plane for Miniaturization and Bandwidth Enhancement,” 2012, Accessed: 00, 2021. [Online]. Available: https://hdl.handle.net/11511/69967.
