A Fabrication Process Flow for Stacked Structural Layer Formation Using Au Au Thermocompression Bonding for RF MEMS Capacitive Switches

Date

2013-07-03

Author

Topallı, Ebru
Çetintepe, Çağrı
Aydın Çivi, Hatice Özlem
Demir, Şimşek
Akın, Tayfun

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https://hdl.handle.net/11511/77087

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Citation Formats

E. Topallı, Ç. Çetintepe, H. Ö. Aydın Çivi, Ş. Demir, and T. Akın, “A Fabrication Process Flow for Stacked Structural Layer Formation Using Au Au Thermocompression Bonding for RF MEMS Capacitive Switches,” 2013, Accessed: 00, 2021. [Online]. Available: https://hdl.handle.net/11511/77087.