Modular Heat Sinks for Enhanced Thermal Management of Electronics

Date

2019-10-09

Author

Hoque, Muhammad Jahidul
Günay, Ahmet Alperen
Stillwell, Andrew
Gurumukhi, Yashraj
Pilawa-Podgurski, Robert
Miljkovic, Nenad

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This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

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URI

https://hdl.handle.net/11511/92466

Conference Name

International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK2019

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Department of Mechanical Engineering, Conference / Seminar

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Modular Heat Sinks for Enhanced Thermal Management of Electronics Hoque, Muhammad Jahidul; Günay, Ahmet Alperen; Stillwell, Andrew; Gurumukhi, Yashraj; Pilawa-Podgurski, Robert C. N.; Miljkovic, Nenad (2021-06-01) Power electronics are vital for the generation, conversion, transmission, and distribution of electrical energy. Improving the efficiency, power density, and reliability of power electronics is an important challenge that can be addressed with electrothermal codesign and optimization. Current thermal management approaches utilize metallic heat sinks (HSs), resulting in parasitic load generation due to different potentials between electronic components on the printed circuit board (PCB). To enable electrical...
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Citation Formats

M. J. Hoque, A. A. Günay, A. Stillwell, Y. Gurumukhi, R. Pilawa-Podgurski, and N. Miljkovic, “Modular Heat Sinks for Enhanced Thermal Management of Electronics,” presented at the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK2019, Anaheim, CA, Amerika Birleşik Devletleri, 2019, Accessed: 00, 2021. [Online]. Available: https://hdl.handle.net/11511/92466.