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Low Loss Skip Layer Transmission Lines with Common Mode Filtering for Packages
Date
2022-01-01
Author
Durgun, Ahmet Cemal
Aygun, Kemal
Metadata
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This work is licensed under a
Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License
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IEEETo address the increasing bandwidth demand in chip-to-chip communication, data rates of high-speed serial input/output interfaces have been aggressively increasing, which tightens the available packaging electrical budgets for channel loss and noise. Enabling a cost effective and a high-volume manufacturing compatible solution to improve these metrics is of great importance. In this paper, we expand on the recently introduced skip-layer based transmission line (TL) technology with simultaneous common mode (CM) filtering properties, which can address both of these challenges simultaneously. The TL is composed of periodic repetitions of narrow and wide sections, which generates a CM impedance contrast to filter out the CM noise, while differential impedance is kept constant by locally voiding the planes below and above the wide trace sections. Because of the wider sections, the loss is also smaller. We provide a theoretical discussion of the CM filtering using Bloch’s Theory on periodic structures. We also provide an analytical formulation, which utilizes quasi-static assumption, for crosstalk control. Finally, we demonstrate the electrical performance of this new TL technology with both numerical and experimental data in frequency and time domains and provide design guidelines to address some of the practical aspects of real-world applications.
Subject Keywords
Attenuation
,
common mode filter
,
Costs
,
Crosstalk
,
Filtering
,
high-speed interfaces
,
Impedance
,
low-loss transmission line
,
Periodic structures
,
periodic structures
,
Power transmission lines
,
skip layer
URI
https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85129426823&origin=inward
https://hdl.handle.net/11511/97585
Journal
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI
https://doi.org/10.1109/tcpmt.2022.3171592
Collections
Department of Electrical and Electronics Engineering, Article
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A. C. Durgun and K. Aygun, “Low Loss Skip Layer Transmission Lines with Common Mode Filtering for Packages,”
IEEE Transactions on Components, Packaging and Manufacturing Technology
, pp. 0–0, 2022, Accessed: 00, 2022. [Online]. Available: https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85129426823&origin=inward.