Solvent Compatibility of Parylene C Film Layer

Date

2014-04-01

Author

Koydemir, H. Ceylan
Külah, Haluk
Özgen, Canan

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Parylene C has been preferred in various microfluidic and packaging applications as a chemical barrier; therefore, its durability in chemicals is critical to maintain functionality of the devices. In this paper, we investigated solvent compatibility of Parylene C in a range of solvents with regard to swelling of it and the change in its surface roughness at room temperature. The results of Parylene C swelling were associated with solubility parameter, delta (cal/cm(3))(1/2), which is predicted from the parameters of dispersion, polar, and hydrogen-bonding forces. Solvents that swelled Parylene C film layer mostly were benzene, chloroform, trichloroethylene, and toluene, while methanol, 2-propanol, ethylene glycol, and water did not cause any swelling. Subsequently, the adverse effects of diffusion of solvents through a Parylene C film layer were demonstrated by stripping of the encapsulated photoresist. In addition, a comparison was made between Parylene C and poly(dimethyl) siloxane (PDMS) considering the data of swelling ratios obtained from the experimental findings and the literature, respectively. Experimental findings showed that Parylene C is much more compatible to solvents than PDMS in high-throughput microfluidic and packaging applications. These results will be of great value to scientists for understanding compatibility of any selected solvent on Parylene C in the applications of micro devices. [2013-0113]

Subject Keywords

Chip scale packaging, Implants, Insulation, Microfluidics, Solvents, Roughness

URI

https://hdl.handle.net/11511/30446

Journal

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS

DOI

https://doi.org/10.1109/jmems.2013.2273032

Collections

Graduate School of Natural and Applied Sciences, Article

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Citation Formats

H. C. Koydemir, H. Külah, and C. Özgen, “Solvent Compatibility of Parylene C Film Layer,” JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, pp. 298–307, 2014, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/30446.