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Plasma-activated direct bonding of patterned silicon-on-insulator wafers to diamond-coated wafers under vacuum
Date
2014-08-01
Author
Can, Uryan Isik
Bayram, Barış
Metadata
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Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License
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Direct wafer bonding requires the surfaces to have low surface roughness (R-a < 0.5 nm) as well as to be free of any particles or contaminants. Meeting these requirements for wafers patterned with lithography and dry etching presents a serious problem in terms of removal of photoresist residue and etch-related particles, which would require expensive additional equipment to be removed. In this study, we propose the use of chemical mechanical polishing (CMP) to be performed after all lithography and dry etch process steps involving several masks are completed. To reduce the adverse effect of any remaining slurry that might reside in the etched structures, we also propose to reduce the maximum annealing temperature from 550 degrees C down to 300 degrees C. The effect of lower annealing temperature on bonding is compensated using a sequential plasma activation with 60 s of O-2 followed by 90 s of N-2 on contacting surfaces made of silicon dioxide to achieve successful wafer bonding. Initial plasma activation with O-2 additionally serves as a final cleaning step whereas the following activation with N-2 for an extended duration is to fully activate the surface for direct bonding. This proposed technique can motivate the use of direct wafer bonding for microfabrication of advanced MEMS devices.
Subject Keywords
Diamond
,
Direct bonding
,
Dry etching
,
Plasma activation
,
Silicon on insulator
,
Capacitive micromachined ultrasonic transducer
URI
https://hdl.handle.net/11511/32720
Journal
DIAMOND AND RELATED MATERIALS
DOI
https://doi.org/10.1016/j.diamond.2014.06.002
Collections
Department of Electrical and Electronics Engineering, Article
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U. I. Can and B. Bayram, “Plasma-activated direct bonding of patterned silicon-on-insulator wafers to diamond-coated wafers under vacuum,”
DIAMOND AND RELATED MATERIALS
, pp. 53–57, 2014, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/32720.