Hide/Show Apps

Enhancement of performance characteristics of epoxy adhesives through particle reinforcement

Yetgin, Hasan
Epoxy adhesives are common bonding agents used to join dissimilar materials. They are widely preferred in aerospace industry. But, their lack of performance at extremities of service temperatures limits their use in practical applications. The aim of this study is to improve the epoxy adhesives’ thermal properties through addition of filler particles, i.e. boron nitride, aluminum oxide, titanium oxide and Au doped titanium oxide. The last one has been developed specifically for this study to enhance the drawbacks of titanium particles in thermal conductivity. In order to have regular samples, a sample preparation method has been suggested. Then, the samples were tested by Dynamic Mechanical Analysis (DMA), Differential Scanning Calorimetry (DSC), Scanning Electron Microscopy (SEM), Thermal Conductivity Measurement, Fourier Transform Infrared Spectroscopy (FTIR) and Single Lap Shear Test. The results showed that adding filler materials had favorable influence on thermal and mechanical performance. For the key parameters of thermal and mechanical performance of adhesives, boron nitride particles had greatest influence on the thermal conductivity. Moreover, Au doped and regular titanium dioxide particles had brilliant results in glass transition temperature. Adhesion strength was enhanced mostly by aluminum dioxide particles. The result of scanning methods validated the suggested sample preparation method. Finally, while Au doped titanium oxide particles enhanced the glass transition temperature, the expected improvement on thermal conductivity value has not been reached