Enhancing thermal conductivity of epoxy with a binary filler system of h-BN platelets and Al2O3 nanoparticles

Date

2020-04-01

Author

Yetgin, Hasan
Veziroglu, Salih
Aktas, Oral Cenk
Yalçınkaya, Tuncay

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This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

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Epoxy resin is a common adhesive bonding material used to join dissimilar materials, especially in the electronics and aerospace industries. However, its low thermal conductivity and high coefficient of thermal expansion limit the direct use of epoxy in practical applications. In order to improve thermo-mechanical properties, we have prepared a series of epoxy composites using a binary system of hexagonal-boron nitride (h-BN) and aluminum oxide (Al2O3) fillers and analyzed the effect of the ratio of these fillers on the thermal conductivity of composites. While h-BN platelets form the main thermal conductive network, Al2O3 nanoparticles bridge the separated h-BN platelets to build more thermal conductive pathways. We proposed the improving of thermal conductivity as well as the mechanical properties of the epoxy matrix by incorporating h-BN and Al2O3 fillers at an optimum ratio.

Subject Keywords

General Chemical Engineering, Polymers and Plastics, Biomaterials

URI

https://hdl.handle.net/11511/42125

Journal

INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES

DOI

https://doi.org/10.1016/j.ijadhadh.2019.102540

Collections

Department of Aerospace Engineering, Article

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Citation Formats

H. Yetgin, S. Veziroglu, O. C. Aktas, and T. Yalçınkaya, “Enhancing thermal conductivity of epoxy with a binary filler system of h-BN platelets and Al2O3 nanoparticles,” INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, pp. 0–0, 2020, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/42125.