CMOS compatible microchannel heat sink for cooling electronic components and its fabrication

2015-9-30
The present invention is a CMOS compatible polymer microchannel heat sink for electronic cooling applications. The heat sink can be fabricated directly on the chip surface with an insulation layer by standard polymer surface micromachining techniques. The heat sink device comprises a thin insulation layer on the chip surface, a thin-film metal layer as bottom surface, metal side walls, and a polymer top wall over the microchannels and inlet-outlet reservoirs.
Citation Formats
H. Külah, A. Koyuncuoğlu, and H. T. Okutucu Özyurt, “CMOS compatible microchannel heat sink for cooling electronic components and its fabrication,” 00, 2015.