Impact of crumb rubber modified binder preparation process on hot mix asphalt performance

Date

2012-06-13

Author

Öztürk, Hande Işık
KUTAY, MUHAMMED EMIN
LITTRUP, GERRIT

Metadata

Show full item record

This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

Item Usage Stats

46
views

0
downloads

URI

https://eapa.org/5th-eurasphalt-eurobitume-congress-2012-in-istanbul/
https://hdl.handle.net/11511/95417

Conference Name

5th Eurasphalt and Eurobitume Congress

Collections

Department of Civil Engineering, Conference / Seminar

Suggestions

OpenMETU
Core

Impact of incorporated oxygen quantity on optical, structural and dielectric properties of reactive magnetron sputter grown high-kappa HfO2/Hf/Si thin film Cantas, A.; AYGÜN ÖZYÜZER, GÜLNUR; Turan, Raşit (Elsevier BV, 2014-11-01) High-kappa hafnium-oxide thin films have been fabricated by radio frequency (rf) reactive magnetron sputtering technique. To avoid formation of an undesired interfacial suboxide layer between Si and high-kappa film, prior to HfO2 deposition, a thin Hf buffer layer was deposited on p-type (100) Si substrate at room temperature. Effect of oxygen gas quantity in the O-2/Ar gas mixture was studied for the optical and structural properties of grown HfO2 high-kappa thin films. The grown thin oxide films were char...
Impact of Fiber Weaves on 56 Gbps SerDes Interface in Glass Epoxy Packages Durgun, Ahmet Cemal (2015-01-01) Some package substrates are composed of glass fiber bundles and epoxy resin which have different electrical properties. These differences result in variations in characteristic impedance and propagation speeds, which may be detrimental at high data rates. The insertion loss (IL), within pair skew and differential to common mode conversion ratio of transmission lines may drastically increase due to the fiber weave effect. Consequently, the link budget of high speed communication channels may be significantly...
Impact of Pad Conditioning on Thickness Profile Control in Chemical Mechanical Planarization Kıncal, Serkan; BAŞIM DOĞAN, GÜL BAHAR (2013-01-01) Chemical mechanical planarization (CMP) has been proven to be the best method to achieve within-wafer and within-die uniformity for multilevel metallization. Decreasing device dimensions and increasing wafer sizes continuously demand better planarization, which necessitates better understanding of all the variables of the CMP process. A recently highlighted critical factor, pad conditioning, affects the pad surface profile and consequently the wafer profile; in addition, it reduces defects by refreshing the...
Impact of hydraulic conductivity heterogeneity on time to compliance Güngör Demirci, Gamze; Aksoy, Ayşegül (null; 2008-06-20)
Impact of rapid thermal annealing on impurities removal efficiency from silicon carbide for optoelectronic applications Barbouche, M.; Zaghouani, R. Benabderrahmane; Benammar, N. E.; Khirouni, K.; Turan, Raşit; Ezzaouia, H. (Springer Science and Business Media LLC, 2019-11-27) Impurities are of crucial interest in optoelectronic devices as they affect carrier lifetimes and electrical properties. In view of that, it is important to incorporate certain processing steps to reduce impurities effect on final devices. The aim of this work is to enhance silicon carbide SiC purity for silicon passivation. Low cost method of SiC purification is presented. This method combines three main steps consisting of formation of porous silicon carbide layers by acid vapor etching followed by a phot...

Citation Formats

H. I. Öztürk, M. E. KUTAY, and G. LITTRUP, “Impact of crumb rubber modified binder preparation process on hot mix asphalt performance,” presented at the 5th Eurasphalt and Eurobitume Congress, İstanbul, Türkiye, 2012, Accessed: 00, 2022. [Online]. Available: https://eapa.org/5th-eurasphalt-eurobitume-congress-2012-in-istanbul/.