Tiling of cellular structures into 3d parts according to the density values of simp topology optimization

2022-01-01
Helvaci, Damla Ozkapici
Yaman, Ulaş
In this study, a novel approach is proposed to enhance the performance of the parts optimized by Solid Isotropic Material with Penalization (SIMP) method. SIMP is a topology optimization method that aims the optimum distribution of material in a design domain subjected to predefined loads, constraints and boundary conditions. The method forces every finite element composing the geometry to have a density of either 1 or 0. The main reason behind penalizing is that regions with intermediate densities are difficult to fabricate. However, including these regions in the optimization output may provide better performance results. Based on this idea, a method is proposed to utilize intermediate densities in a manufacturable form and is applied to 3D geometries. Besides, the remodeled topology is checked against any unconnected cells. In contrast to many methods, which delete the unconnected elements, the proposed method provides connectivity by adding cells. The outputs of the proposed method are fabricated by using Electron Beam Melting (EBM) and Stereolithography (SLA) technologies. EBM uses material powder and a heat source to melt and fuse the powders while SLA uses photosensitive resin and an ultraviolet light to cure the resin. A common limitation of both technologies is that powder/resin may remain inside the internal features which do not have access to outer surface of the part through the channels. The proposed method ensures the easy removal of excess powder/resin after fabrication. Performance of the method is compared with the SIMP method through test and analysis.
ASME 2022 17th International Manufacturing Science and Engineering Conference, MSEC 2022

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Citation Formats
D. O. Helvaci and U. Yaman, “Tiling of cellular structures into 3d parts according to the density values of simp topology optimization,” Indiana, Amerika Birleşik Devletleri, 2022, vol. 1, Accessed: 00, 2023. [Online]. Available: https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85140927740&origin=inward.