Flow mechanisms and their influence on the properties of EGaIn-graphene-poly(ethylene) oxide composites during material extrusion-based additive manufacturing

2024-03-25
Tandel, Ruchira
Sargın, Irmak
Gozen, B. Arda
Polymer composites featuring room temperature liquid alloy particles complimenting other conductive fillers enable unique thermal and electrical properties. Direct-ink-writing approach is an intriguing processing path for these material systems, offering high resolution microstructural and property control. This paper investigates the composition-process-property relationships for material extrusion-based additive manufacturing of EGaIn-Graphene-Poly(ethylene) Oxide composites. Particularly, the influence of composite composition, printing nozzle size and flow rate on electrical conductivity is studied through a mechanistic approach. In that, capillary rheometry and flow modeling was performed to describe the contribution of shear flow and wall slip to the ink flow and how they drive the conductivity of printed structures for various composite ink compositions and process parameters. Influence of composition on material property and process driven conductivity were separately analyzed. Results indicate that EGaIn particles hinder material property-driven baseline average conductivity at high graphene loading. Shear flow and wall slip both increase conductivity. Graphene and total active material concentration increase wall slip and decrease shear flow, leading to a net negative effect of total active material concentration on conductivity. These findings will contribute to composite and process design towards additive manufacturing of composites with as-designed properties.
Additive Manufacturing
Citation Formats
R. Tandel, I. Sargın, and B. A. Gozen, “Flow mechanisms and their influence on the properties of EGaIn-graphene-poly(ethylene) oxide composites during material extrusion-based additive manufacturing,” Additive Manufacturing, vol. 84, pp. 0–0, 2024, Accessed: 00, 2024. [Online]. Available: https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85189757305&origin=inward.