Electronic packaging and environmental test and analysis of an emi shielded electronic unit for naval platform

Download
2008
Devellioğlu, Yücel
The scope of this thesis is the design and verification of an electronic packaging of a device which is a subunit of a network system that is designed for combat communication in sheltering ship. According to the project requirements this device is subjected to some environmental and electromagnetic interference tests. This thesis includes design and manufacturing steps as well as vibration, shock and thermal analyses. Electromagnetic interference is examined through the design procedure and total shielding effectiveness of the device is calculated after the applications of some electromagnetic interference precautions which are given in details.

Suggestions

Improving performance of a remote robotic teleoperation over the internet
Arslan, Mehmet Selçuk; Konukseven, Erhan İlhan; Department of Mechanical Engineering (2005)
In this thesis study, it is aimed to improve the performance of an Internet-based teleoperation system enabling the remote operation of a 6 DOF industrial robot. In order to improve the safety and efficiency of the teleoperation, stability and synchronization (hand-eye coordination) are considered. The selected communication medium between the human operator and remote robot is the Internet. The variable time delays and nondeterministic characteristics of the Internet may lead to instability of the teleoper...
Design and construction of a folding mechanism for a radar system
Yurt, Hünkar Kemal; Turgut, Ali Emre; Department of Mechanical Engineering (2019)
In this thesis, a folding mechanism with 1 degrees of freedom is designed and constructed for a two-antenna radar system. The optimum mechanism for the problem is systematically selected among the conceptual mechanism alternatives. Then, a detailed synthesis and analysis study is performed on the selected mechanism, and the mechanism is implemented to the geometry of the radar system. By performing modal and strength analyses on the 3D model of the folding mechanism created during the implementation study, ...
Digital control of universal telecommunication power supplies using dual 8-bit microcontrollers
Kutluay, K; Cadirci, I; Yafavi, A; Cadirci, Y (2002-10-18)
Design and implementation of a digital controller for universal telecommunication power supply modules are presented. The paper emphasises on converter control strategy, and its implementation by means of parallel operated, dual 8-bit microcontrollers. One of the microcontrollers is employed for user interface purposes, such as long term records, display and alarm facilities, which are inherently slow processes. The fast processing speed required by output voltage setting, current limit, and load current sh...
Laser Sculpting and Processing of Silicon for Photovoltaics
Bek, Alpan (2017-12-07)
Direct writing of photonic and fluidic devices in Si by means of laser processing is of great importance as it promisses low-cost, rapid fabrication of Si devices. Although Si microfabrication techniques are well-established and technologically mature, the fabrication time and costs are still of importance as clean room environment, repetitive photomasking, mask aligning, thermal processing steps are typical requirements. Advancements in fiber laser technology has reached a stage such that high average powe...
Vibration analysis of pcbs and electronic components
Aytekin, Banu; Özgüven, Hasan Nevzat; Department of Mechanical Engineering (2008)
In this thesis, vibration analyses of electronic assemblies that consist of an electronic box, printed circuit board and electronic components are presented. A detailed vibration analysis of a real electronic assembly is performed by finite element methods and vibration tests. Effects of component addition and component modeling are investigated by finite element analysis in detail. Results are compared in order to identify the most efficient, reliable and suitable method depending on the type of problem. E...
Citation Formats
Y. Devellioğlu, “Electronic packaging and environmental test and analysis of an emi shielded electronic unit for naval platform,” M.S. - Master of Science, Middle East Technical University, 2008.