Control of the thickness distribution of evaporated functional electroceramic NTC thermistor thin films

Date

2008-04-01

Author

Schmidt, R.
Parlak, Mehmet
Brinkman, Am

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In this work the thickness distribution of NTC thermistor thin films produced by low deposition rate (0.8 nm s(-1)) electron-beam evaporation is investigated. The target preparation, deposition conditions and geometrical set-up of the evaporation mechanism are described in detail. The evaporation geometry is shown to be critical for the thickness distribution of evaporated films. The film thickness distribution of evaporated layers was measured across a macroscopic film surface using Alpha Step stylus profileometer. The thickness distribution was fitted using a geometrical model derived from evaporation theory, based on the Hertz-Knudsen equation and a modified version of the cosine law of emission. From this model, the sticking coefficient of the vapour on the substrates could be estimated to be 80 +/- 1.5%.

Subject Keywords

Modelling and Simulation, Industrial and Manufacturing Engineering, Metals and Alloys, Ceramics and Composites, Computer Science Applications

URI

https://hdl.handle.net/11511/40558

Journal

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

DOI

https://doi.org/10.1016/j.jmatprotec.2007.08.014

Collections

Department of Physics, Article

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Citation Formats

R. Schmidt, M. Parlak, and A. Brinkman, “Control of the thickness distribution of evaporated functional electroceramic NTC thermistor thin films,” JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, pp. 412–416, 2008, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/40558.