Terahertz Bandpass Frequency Selective Surfaces on Glass Substrates Using a Wet Micromachining Process

Date

2017-08-01

Author

Ramzan, Mehrab
Khan, Talha Masood
Bolat, Sami
NEBİOĞLU, Mehmet Ali
Altan, Hakan
Okyay, Ali Kemal
Topalli, Kagan

Metadata

Show full item record

This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

Item Usage Stats

8
views

0
downloads

This paper presents terahertz (THz) frequency selective surfaces (FSS) implemented on glass substrate using standard microfabrication techniques. These FSS structures are designed for frequencies around 0.8 THz. A fabrication process is proposed where a 100-mu m-thick glass substrate is formed through the HF etching of a standard 500-mu m-thick low cost glass wafer. Using this fabrication process, three separate robust designs consisting of single-layer FSS are investigated using high-frequency structural simulator (HFSS). Based on the simulation results, the first design consists of a circular ring slot in a square metallic structure on top of a 100-mu m-thick Pyrex glass substrate with 70% transmission bandwidth of approximately 0.07 THz, which remains nearly constant till 30A degrees angle of incidence. The second design consists of a tripole structure on top of a 100-mu m-thick Pyrex glass substrate with 65% transmission bandwidth of 0.035 THz, which remains nearly constant till 30A degrees angle of incidence. The third structure consists of a triangular ring slot in a square metal on top of a 100-mu m-thick Pyrex glass substrate with 70% transmission bandwidth of 0.051 THz, which remains nearly constant up to 20A degrees angle of incidence. These designs show that the reflections from samples can be reduced compared to the conventional sample holders used in THz spectroscopy applications, by using single layer FSS structures manufactured through a relatively simple fabrication process. Practically, these structures are achieved on a fabricated 285-mu m-thick glass substrate. Taking into account the losses and discrepancies in the substrate thickness, the measured results are in good agreement with the electromagnetic simulations.

Subject Keywords

Instrumentation, Electrical and Electronic Engineering, Radiation, Condensed Matter Physics

URI

https://hdl.handle.net/11511/42399

Collections

Department of Physics, Article