Passive Cooling Assembly for Flat Panel Displays with Integrated High Power Components

2009-08-01
Passive cooling of flat panel display designs with integrated high power components is investigated with the help of recently available semi-emprical and CFD based heat transfer correlations. A heat-spreader-heat-sink assembly is proposed for effective external natural convection cooling of the display panel. A flat vertical surface and plate finned heat sinks with various fin heights are considered as heat sinks in the assembly. Heat dissipation limits for both types of heat sinks are determined for various panel dimensions. It is shown that,for large panels, it is feasible to use passive cooling even when integrated computer components are used in panels for demanding applications such as video games, high definition video processing and 2-D to 3-D conversion(1).
IEEE TRANSACTIONS ON CONSUMER ELECTRONICS

Suggestions

Heat transfer and pressure drop experiments on CMOS compatible microchannel heat sinks for monolithic chip cooling applications
Koyuncuoglu, Aziz; Jafari, Rahim; Okutucu-Ozyurt, Tuba; Külah, Haluk (2012-06-01)
Novel CMOS compatible microchannel heat sinks are designed, fabricated and tested for monolithic liquid cooling of integrated circuits. The proposed heat sink is fabricated by low temperature surface micromachining processes and requires no design change of the electronic circuitry underneath, hence, can be produced by adding a few more steps to the standard CMOS fabrication flow. The microchannel heat sinks were tested successfully under various heat flux and coolant flow rate conditions. The cooling tests...
Hydrodynamic ve Thermal Modelling of Circulating Fluidized Bed Solar Receivers
Bilyaz, Serhat; Tarı, İlker (2016-11-17)
The riser tube solar receiver of a circulating fluidized bed solid particle absorption solar thermal energy system was numerically modeled for analyzing hydrodynamic and heat transfer behaviors of the solid particles in the riser. Hydrodynamics of the model is validated by comparing radial distribution of void fractions with an experimental study. For the heat transfer from the opaque walls of the receiver that is heated to high temperatures by the solar rays concentrated by the heliostat field, a simple fr...
Performance analysis of grooved heat pipes using 3-D multi-channel thermal resistance network
Sezmen, Ramazan Aykut; Dursunkaya, Zafer; Çetin, Barbaros; Department of Mechanical Engineering (2021-9)
Heat pipes are phase change heat transfer devices that transfer high amounts of heat with low temperature differences compared to conventional cooling techniques due to their high thermal conductivity. Since heat pipes do not require any external power supply and not involve any moving parts, they are preferred for high reliability applications and in wide range of industrial applications from thermal management of electronics to space applications. Essentially, heat pipes use the advantage of occurring pha...
Implementation of metal-based microchannel heat exchangers in a microrefrigeration cycle, and numerical and experimental investigation of surface roughness effects on flow boiling
Jafari Khousheh Mehr, Rahim; Okutucu Özyurt, Hanife Tuba; Ünver, Hakkı Özgür; Department of Mechanical Engineering (2015)
A microscale vapor compression refrigeration cycle has been constructed for possible application in the thermal management of compact electronic components. The micro-evaporator and micro-condenser components have been fabricated using wire electron discharge machining and micromilling, respectively. Three microevaporators have been manufactured with different surface roughness for the experimental and numerical investigation of roughness effect on nucleate flow boiling in microchannels. In the numerical pa...
HYDRODYNAMIC AND THERMAL MODELING OF CIRCULATING FLUIDIZED BED SOLAR RECEIVERS
Bilyaz, Serhat; Tarı, İlker (2016-11-17)
The riser tube solar receiver of a circulating fluidized bed solid particle absorption solar thermal energy system was numerically modeled for analyzing hydrodynamic and heat transfer behaviors of the solid particles in the riser. Hydrodynamics of the model is validated by comparing radial distribution of void fractions with an experimental study. For the heat transfer from the opaque walls of the receiver that is heated to high temperatures by the solar rays concentrated by the heliostat field, a simple fr...
Citation Formats
İ. Tarı, “Passive Cooling Assembly for Flat Panel Displays with Integrated High Power Components,” IEEE TRANSACTIONS ON CONSUMER ELECTRONICS, pp. 1707–1713, 2009, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/46332.