Morphological evolution of intragranular void under the thermal-stress gradient generated by the steady state heat flow in encapsulated metallic films: Special reference to flip chip solder joints

Date

2007-11-30

Author

Ogurtani, Tarik Omer
Akyildiz, Oncu

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The morphological evolution of intragranular voids induced by the surface drift-diffusion under the action of capillary forces, electromigration (EM) forces, and thermal stress gradients (TSG) associated with steady state heat flow is investigated in passivated metallic thin films via computer simulation using the front-tracking method. As far as the device reliability is concerned, the most critical configuration for interconnect failure occurs even when thermal stresses are low if the normalized ratio of interconnect width to void radius is less than certain range of values (which indicates the onset of heat flux crowding). This regime manifests itself by the formation of two symmetrically disposed finger shape extrusions (pitchfork shape slits) on the upper and lower shoulders of the void surface on the windward side. The void growth (associated with supersaturated vacancy condensation) on the other hand inhibits anode displacement but enhances cathode and shoulder slit velocities drastically, which causes lateral spreading.

Subject Keywords

General Materials Science, Atomic and Molecular Physics, and Optics, Condensed Matter Physics

URI

https://hdl.handle.net/11511/65005

DOI

https://doi.org/10.4028/www.scientific.net/ssp.139.151

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Department of Physics, Conference / Seminar

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Morphological evolution of voids by surface drift diffusion driven by capillary, electromigration, and thermal-stress gradients induced by steady-state heat flow in passivated metallic thin films and flip chip solder joints. I. Theory Ogurtani, Tarik Omer; Akyildiz, Oncu (AIP Publishing, 2008-07-15) The morphological evolution of intragranular voids induced by surface drift diffusion under the actions of capillary and electromigration (EM) forces and thermal-stress gradients (TSGs) associated with steady-state heat flow is investigated in passivated metallic thin films and flip chip solder joints via computer simulation using the front-tracking method. In the mesoscopic nonequilibrium thermodynamic formulation of the generalized driving forces for the thermal-stress-induced surface drift diffusion, not...
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Morphological evolution of voids by surface drift diffusion driven by the capillary, electromigration, and thermal-stress gradient induced by the steady state heat flow in passivated metallic thin films and flip-chip solder joints. II. Applications Ogurtani, Tarik Omer; Akyildiz, Oncu (AIP Publishing, 2008-07-15) The void growth and drift motion induced by the combined actions of the phase transformation (evaporation and condensation) and surface drift diffusion driven by the capillary and electromigration forces and thermal-stress gradients are investigated in passivated metallic thin films and flip-chip solder joints via computer simulation using the front-tracking method. As far as the device reliability is concerned, the most critical configuration for solder joint failure occurs even when thermal stresses are l...
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Citation Formats

T. O. Ogurtani and O. Akyildiz, “Morphological evolution of intragranular void under the thermal-stress gradient generated by the steady state heat flow in encapsulated metallic films: Special reference to flip chip solder joints,” 2007, vol. 139, p. 151, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/65005.