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Grain boundary strengthening in dilute nanocrystalline Cu alloys
Date
2011-11-28
Author
Özerinç, Sezer
Vo, Nhon
Averback, Robert
Bellon, Pascal
Dillon, Shen
King, William
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https://hdl.handle.net/11511/77415
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Grain boundary doping strengthens nanocrystalline copper alloys
Özerinç, Sezer; Vo, Nhon Q.; BELLON, Pascal; Averback, Robert S.; King, William P. (2012-10-01)
Nanoindentation hardness measurements were performed on nanocrystalline (nc-) Cu alloys to test recent molecular dynamics predictions that (i) solute segregation to grain boundaries can lead to significant strengthening and (ii) solutes with large size mismatch with Cu are most effective. Results show that the hardness of nc-Cu90Nb10 is greater than 5 GPa, more than double that of pure nc-Cu, whereas similar additions of Fe solute have nearly no effect. These results are in good agreement with simulations. ...
Grain size stabilization of oxide dispersion strengthened CoCrFeNi-Y(2)O3 high entropy alloys synthesized by mechanical alloying
Tekin, Mustafa; Polat, Gokhan; Kalay, Yunus Eren; KOTAN, HASAN (2021-12-01)
Nanocrystalline CoCrFeNi high entropy alloys (HEAs) with 1 and 4 wt% nanosized Y2O3 were synthesized by high energy mechanical alloying and subjected to annealing treatments at different temperatures up to 1100 degrees C. X-ray diffraction (XRD), focused ion beam microscopy (FIB), and transmission electron microscopy (TEM) were used to investigate the microstructures of as-milled and annealed HEAs as a function of annealing temperature and Y2O3 content. The results have shown that the as-milled HEAs were so...
Grain boundary grooving and cathode voiding in bamboo-like metallic interconnects by surface drift diffusion under the capillary and electromigration forces
Ogurtani, TO; Akyildiz, O (AIP Publishing, 2005-05-01)
The process of grain boundary (GB) grooving and cathode voiding in sandwich type thin film bamboo lines are simulated by introducing a mathematical model, which flows from the fundamental postulates of irreversible thermodynamics. In the absence of the electric field, the computer studies on the triple junction kinetics show that it obeys the first order reaction kinetics at early transient stage, which is followed by the familiar time law as (t) over bar (1/4), at the steady state regime. The applied elect...
Grain boundary grooving induced by the anisotropic surface drift diffusion driven by the capillary and electromigration forces: Simulations
Akyildiz, Oncu; Ogurtani, Tarik Omer (AIP Publishing, 2011-08-15)
The morphological evolution kinetics of a bicrystal thin film induced by anisotropic surface drift diffusion and driven by the applied electrostatic field is investigated via self consistent dynamical computer simulations. The physico-mathematical model, which is based upon the irreversible thermodynamic treatment of surfaces and interfaces with singularities [T. O. Ogurtani, J. Chem. Phys. 124, 144706 (2006)], provided us with auto-control on the otherwise free-motion of the triple junction at the intersec...
Grain boundary grooving in bi-crystal thin films induced by surface drift-diffusion driven by capillary forces and applied uniaxial tensile stresses
Akyildiz, Oncu; ÖREN, ERSİN EMRE; Ogurtani, Tarik Omer (2012-01-01)
Grain boundary (GB) grooving, induced by surface drift-diffusion and driven by the combined actions of capillary forces and applied uniaxial tensile stresses, is investigated in bi-crystal thin films using self-consistent dynamical computer simulations. A physico-mathematical model, based on the irreversible thermodynamics treatment of surfaces and interfaces with singularities allowed auto-control of the otherwise free-motion of the triple junction at the intersection of the grooving surface and the GB, wi...
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S. Özerinç, N. Vo, R. Averback, P. Bellon, S. Dillon, and W. King, “Grain boundary strengthening in dilute nanocrystalline Cu alloys,” 2011, Accessed: 00, 2021. [Online]. Available: https://hdl.handle.net/11511/77415.