Show/Hide Menu
Hide/Show Apps
Logout
Türkçe
Türkçe
Search
Search
Login
Login
OpenMETU
OpenMETU
About
About
Open Science Policy
Open Science Policy
Open Access Guideline
Open Access Guideline
Postgraduate Thesis Guideline
Postgraduate Thesis Guideline
Communities & Collections
Communities & Collections
Help
Help
Frequently Asked Questions
Frequently Asked Questions
Guides
Guides
Thesis submission
Thesis submission
MS without thesis term project submission
MS without thesis term project submission
Publication submission with DOI
Publication submission with DOI
Publication submission
Publication submission
Supporting Information
Supporting Information
General Information
General Information
Copyright, Embargo and License
Copyright, Embargo and License
Contact us
Contact us
Grain boundary grooving induced by the anisotropic surface drift diffusion driven by the capillary and electromigration forces: Simulations
Date
2011-08-15
Author
Akyildiz, Oncu
Ogurtani, Tarik Omer
Metadata
Show full item record
This work is licensed under a
Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License
.
Item Usage Stats
196
views
0
downloads
Cite This
The morphological evolution kinetics of a bicrystal thin film induced by anisotropic surface drift diffusion and driven by the applied electrostatic field is investigated via self consistent dynamical computer simulations. The physico-mathematical model, which is based upon the irreversible thermodynamic treatment of surfaces and interfaces with singularities [T. O. Ogurtani, J. Chem. Phys. 124, 144706 (2006)], provided us with auto-control on the otherwise free-motion of the triple junction at the intersection of the grooving surface and the grain boundary, without having any a priori assumption on the equilibrium dihedral angles. The destruction of the symmetry of the freshly formed grain boundary grooves under the anisotropic surface diffusion driven by the concurrent action of the capillarity and electromigration is observed. After prolonged exposure times the applied electric field above the well defined threshold level modifies Mullins' familiar stationary state time law as, t(-1/4), and causes the premature termination of the groove penetration because of the current crowding at the tips of counteracting grain boundary-grooves initiated on both sides of the test modulus. That finding indicates that the electromigration plays the same role as a healing agent [T. O. Ogurtani, J. Appl. Phys. 106, 053503 (2009)] in arresting the thermal grooving, thereby avoiding the premature interconnect failure as in the case of surface roughening and crack initiation caused by compressive stress gradients. The role of the electromigration and wetting parameter on the ridge/slit formations are thoroughly investigated in this study and the prerequisite conditions are also identified. (C) 2011 American Institute of Physics. [doi:10.1063/1.3624733]
Subject Keywords
General Physics and Astronomy
URI
https://hdl.handle.net/11511/65803
Journal
JOURNAL OF APPLIED PHYSICS
DOI
https://doi.org/10.1063/1.3624733
Collections
Department of Metallurgical and Materials Engineering, Article
Suggestions
OpenMETU
Core
Surface morphological evolution on single crystal films by strong anisotropic drift diffusion under capillary and electromigration forces
Ogurtani, Tarik Omer; Celik, Aytac (AIP Publishing, 2006-08-15)
The morphological evolution of voids at unpassivated surfaces and the sidewalls of single crystal metallic films is investigated via computer simulations by using a mathematical model based on fundamental postulates of irreversible thermodynamics. The effect of drift-diffusion anisotropy on the development of surface morphological scenarios is explored under the action of electromigration (EM) and capillary forces, utilizing numerous combinations of the surface texture and the direction of the applied elect...
Morphological evolution of voids by surface drift diffusion driven by capillary, electromigration, and thermal-stress gradients induced by steady-state heat flow in passivated metallic thin films and flip chip solder joints. I. Theory
Ogurtani, Tarik Omer; Akyildiz, Oncu (AIP Publishing, 2008-07-15)
The morphological evolution of intragranular voids induced by surface drift diffusion under the actions of capillary and electromigration (EM) forces and thermal-stress gradients (TSGs) associated with steady-state heat flow is investigated in passivated metallic thin films and flip chip solder joints via computer simulation using the front-tracking method. In the mesoscopic nonequilibrium thermodynamic formulation of the generalized driving forces for the thermal-stress-induced surface drift diffusion, not...
Grain boundary grooving and cathode voiding in bamboo-like metallic interconnects by surface drift diffusion under the capillary and electromigration forces
Ogurtani, TO; Akyildiz, O (AIP Publishing, 2005-05-01)
The process of grain boundary (GB) grooving and cathode voiding in sandwich type thin film bamboo lines are simulated by introducing a mathematical model, which flows from the fundamental postulates of irreversible thermodynamics. In the absence of the electric field, the computer studies on the triple junction kinetics show that it obeys the first order reaction kinetics at early transient stage, which is followed by the familiar time law as (t) over bar (1/4), at the steady state regime. The applied elect...
Morphological evolution of voids by surface drift diffusion driven by the capillary, electromigration, and thermal-stress gradient induced by the steady state heat flow in passivated metallic thin films and flip-chip solder joints. II. Applications
Ogurtani, Tarik Omer; Akyildiz, Oncu (AIP Publishing, 2008-07-15)
The void growth and drift motion induced by the combined actions of the phase transformation (evaporation and condensation) and surface drift diffusion driven by the capillary and electromigration forces and thermal-stress gradients are investigated in passivated metallic thin films and flip-chip solder joints via computer simulation using the front-tracking method. As far as the device reliability is concerned, the most critical configuration for solder joint failure occurs even when thermal stresses are l...
Theoretical investigation of charge accumulation layer on the Bi-induced InAs(111)-(2 x 2) surface
Ozkaya, S.; Usanmaz, D.; ÇAKMAK, MELEK; Alkan, B.; Ellialtıoğlu, Süleyman Şinasi (AIP Publishing, 2014-04-28)
Based on pseudopotential method and density functional theory, we have investigated the stability, atomic geometry, and detailed electronic structures for Bi adsorbates on the InAs(111)-(2 x 2) surface with three different sites: (i) T-4 (Bi trimer centered on T-4 site), (ii) H-3 (Bi trimer centered on H-3 site), and (iii) T-4-H-3 (which is formed by trimers with opposite orientations: one centered on a T-4 site and the other on a H-3). Our total energy calculations suggest that adsorption on the T-4-H-3 si...
Citation Formats
IEEE
ACM
APA
CHICAGO
MLA
BibTeX
O. Akyildiz and T. O. Ogurtani, “Grain boundary grooving induced by the anisotropic surface drift diffusion driven by the capillary and electromigration forces: Simulations,”
JOURNAL OF APPLIED PHYSICS
, pp. 0–0, 2011, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/65803.