Grain boundary grooving and cathode voiding in bamboo-like metallic interconnects by surface drift diffusion under the capillary and electromigration forces

Date

2005-05-01

Author

Ogurtani, TO
Akyildiz, O

Metadata

Show full item record

This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

Item Usage Stats

152
views

0
downloads

The process of grain boundary (GB) grooving and cathode voiding in sandwich type thin film bamboo lines are simulated by introducing a mathematical model, which flows from the fundamental postulates of irreversible thermodynamics. In the absence of the electric field, the computer studies on the triple junction kinetics show that it obeys the first order reaction kinetics at early transient stage, which is followed by the familiar time law as (t) over bar (1/4), at the steady state regime. The applied electric field (EF) in constant current experiments modifies this time law drastically above the well-defined electron wind intensity (EWI) threshold, and puts an upper limit for the groove depth, which decreases monotonically with EWI. Below the threshold level, the capillary regime predominates, and EF has little effect on the general kinetics of GB grooving, other than the linear increase in total elapsed time with EWI. An analytical formula for the cathode failure time in constant voltage test is obtained in terms of the system parameters, which are closely associated with the cathode voiding or grain thinning by surface drift diffusion. (C) 2005 American Institute of Physics.

Subject Keywords

General Physics and Astronomy

URI

https://hdl.handle.net/11511/64449

Journal

JOURNAL OF APPLIED PHYSICS

DOI

https://doi.org/10.1063/1.1883305

Collections

Department of Metallurgical and Materials Engineering, Article

Suggestions

OpenMETU
Core

Grain boundary grooving induced by the anisotropic surface drift diffusion driven by the capillary and electromigration forces: Simulations Akyildiz, Oncu; Ogurtani, Tarik Omer (AIP Publishing, 2011-08-15) The morphological evolution kinetics of a bicrystal thin film induced by anisotropic surface drift diffusion and driven by the applied electrostatic field is investigated via self consistent dynamical computer simulations. The physico-mathematical model, which is based upon the irreversible thermodynamic treatment of surfaces and interfaces with singularities [T. O. Ogurtani, J. Chem. Phys. 124, 144706 (2006)], provided us with auto-control on the otherwise free-motion of the triple junction at the intersec...
Surface morphological evolution on single crystal films by strong anisotropic drift diffusion under capillary and electromigration forces Ogurtani, Tarik Omer; Celik, Aytac (AIP Publishing, 2006-08-15) The morphological evolution of voids at unpassivated surfaces and the sidewalls of single crystal metallic films is investigated via computer simulations by using a mathematical model based on fundamental postulates of irreversible thermodynamics. The effect of drift-diffusion anisotropy on the development of surface morphological scenarios is explored under the action of electromigration (EM) and capillary forces, utilizing numerous combinations of the surface texture and the direction of the applied elect...
Defect-controlled transport properties of metallic atoms along carbon nanotube surfaces Barinov, Alexei; Toffoli, Hande; Fabris, Stefano; Gregoratti, Luca; Aballe, Lucia; Dudin, Pavel; Baroni, Stefano; Kiskinova, Maya (American Physical Society (APS), 2007-07-01) The diffusion mechanism of indium atoms along multiwalled carbon nanotubes is studied by means of photoemission spectromicroscopy and density functional theory calculations. The unusually high activation temperature for diffusion (approximate to 700 K), the complex C 1s and In 3d(5/2) spectra, and the calculated adsorption energies and diffusion barriers suggest that the indium transport is controlled by the concentration of defects in the C network and proceeds via hopping of indium adatoms between C vacan...
Morphological evolution of voids by surface drift diffusion driven by capillary, electromigration, and thermal-stress gradients induced by steady-state heat flow in passivated metallic thin films and flip chip solder joints. I. Theory Ogurtani, Tarik Omer; Akyildiz, Oncu (AIP Publishing, 2008-07-15) The morphological evolution of intragranular voids induced by surface drift diffusion under the actions of capillary and electromigration (EM) forces and thermal-stress gradients (TSGs) associated with steady-state heat flow is investigated in passivated metallic thin films and flip chip solder joints via computer simulation using the front-tracking method. In the mesoscopic nonequilibrium thermodynamic formulation of the generalized driving forces for the thermal-stress-induced surface drift diffusion, not...
Density functional theory investigation of two-dimensional dipolar fermions in a harmonic trap Toffoli, Hande; TANATAR, BİLAL (2014-08-13) We investigate the behavior of polarized dipolar fermions in a two-dimensional harmonic trap in the framework of the density functional theory (DFT) formalism using the local density approximation. We treat only a few particles interacting moderately. Important results were deduced concerning key characteristics of the system such as total energy and particle density. Our results indicate that, at variance with Coulombic systems, the exchangecorrelation component was found to provide a large contribution to...

Citation Formats

T. Ogurtani and O. Akyildiz, “Grain boundary grooving and cathode voiding in bamboo-like metallic interconnects by surface drift diffusion under the capillary and electromigration forces,” JOURNAL OF APPLIED PHYSICS, pp. 0–0, 2005, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/64449.