Analysis and optimization of activated carbon coated heat sinks

With the enhancements in nanotechnology, electronic devices shrank in size which led to a necessity to develop efficient thermal management strategies. These small electronic devices could be thermally managed through passive systems provided that effective materials are developed. Here, we use a layer of activated carbon on top of anodized aluminum heat sinks to utilize the sorption cycle of atmospheric water to create a desorption induced evaporative cooling effect. The material properties of the activated carbon lead to enhanced cooling by radiation and desorption, while the geometry of the heat sinks ensure surface area maximization. We develop a numerical simulation platform to determine the optimum geometry and the optimal activated carbon coating mass. Our results show that as the fin diameter and spacing shrink, and as the activated carbon mass increases within the considered range (0-100 mg), effective cooling of the chip could be achieved. We further employ our simulations to decouple the effects of desorption, radiation, and convection. Our analyses reveal that desorption only plays a vital role during the initial periods of operation, while cooling due to radiation and convection leads to an approximate to 20% increase in the overall steady-state heat transfer coefficient. This study goes beyond introducing a passive thermal management strategy for small electronic chips by providing a link between mass diffusion and thermal processes for effective transient operation of thermal devices.


Investigation of flow and heat transfer behavior of integrated pin fin-aluminum foam heat sink
ŞAHİN, Yiğit Serkan; TOPRAK, Beytullah İsmet; SOLMAZ, İsmail; Bayer, Özgür (2023-01-01)
With the rapid development in the electronics industry, the thermal management of high power density elec-tronic products (HPDEPs) has become very important and requires innovative heat removal technologies. In this study, an integrated heat sink (IHS) fabricated by combining aluminum foam and pin-finned heat sink config-urations that are frequently used in the cooling of electronic products has been proposed as an effective solution for the thermal management of HPDEPs. The heat removal and pressure drop c...
Investigation of secondary cooling design enhancements in thermally limited compact notebooks
Khan, Muhammad Azhar Ali; Uzgoren, Eray; Muhtaroglu, Ali (2017-01-01)
Thermal design enhancements in a thermally limited compact notebook system are investigated in this paper. System temperature, power, and fan speed are characterized under a range of activity levels. A finite element model is developed, and validated against measurements. Design enhancements improve cooling with minimum intrusion to the existing mechanical design. A passive secondary heat pipe in the system reduces the CPU temperature by 5 degrees C, and improves the system performance through increased CPU...
Zolfaghari Borra, Mona; Bek, Alpan; Ünalan, Hüsnü Emrah; Department of Micro and Nanotechnology (2021-7-29)
The integration of photonic components with electrical elements on the same silicon chip may lead to the development of new technologies. One limitation is the space available on the wafer surface, which is restricted. Currently, conventional fabrication techniques produce devices only on the top thin layer of the wafer surface. As a result, new architectural designs are required. Producing functional components deep inside Si without creating damage to the surfaces is a potential technique for overcoming t...
Comparison of Intelligent Classification Techniques by Practicing a Specific Technology Audit
Berkol, A.; Kara, G.; Turk, A. (2016-09-08)
Technology audit activities arc carried out for assessment of firms' technological requirements, capacity or management capability. The aim of these assessments is to define the weaknesses of firms and develop actions in order to improve firms' technological capacity and/or technology management capability. Generally these activities are implemented with survey questionnaires. These questionnaires can be filled by managers of firms or can be implemented as an interview by independent experts. However, evalu...
Fabrication and investigation of extremely thin CdTe absorber layer solar cells
Hosseini, Arezoo; Erçelebi, Ayşe Çiğdem; Turan, Raşit; Department of Physics (2016)
Extremely thin absorber layer (ETA) solar cells aim to combine the advantages of using very thin and cheaply produced absorber layer on nano structured substrates with stability of all-solid-state solar cells. This type of photovoltaic devices use a nano structured interpenetrating heterojunction of thin light-absorbing layer at the interface between an n- and p-type semiconductors. N-type nano structured TiO2 layer is deposited on a Transparent Conducting Oxide coated glass (TCO) substrate, following with ...
Citation Formats
A. A. Günay, “Analysis and optimization of activated carbon coated heat sinks,” ISI BILIMI VE TEKNIGI DERGISI-JOURNAL OF THERMAL SCIENCE AND TECHNOLOGY, vol. 42, no. 1, pp. 65–74, 2022, Accessed: 00, 2022. [Online]. Available: