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Computer simulation of electromigration induced void grain boundary interactions and the prediction of cathode failure times in bamboo structures
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143618.pdf
Date
2003
Author
Ören, Ersin Emre
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Subject Keywords
Electrodiffusion
,
Thin films
,
Metallic films
,
Surfaces (Technology)
,
Surfaces (Physics)
,
Interfaces (Physical sciences)
URI
https://hdl.handle.net/11511/13003
Collections
Graduate School of Natural and Applied Sciences, Thesis
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E. E. Ören, “Computer simulation of electromigration induced void grain boundary interactions and the prediction of cathode failure times in bamboo structures,” Ph.D. - Doctoral Program, Middle East Technical University, 2003.