Formation of gold plated electroformed copper structures

Date

2016-01-01

Author

Arslan, Burcu
Karakaya, İshak

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Gold-plated electroformed copper structures are used to protect sensors from stray radiation and improve the image quality in infrared cameras, imaging systems, missile guidance systems and several other devices. These multilayer electroformed objects have tight dimensional and weight tolerances. Furthermore, their internal and external surfaces often exhibit low and high emissivity, respectively. Reflectivity at the outer surface was achieved by gold electrodeposition. Moreover, inner copper layer was converted to copper oxides to obtain high absorption. Characterisation of the coatings were done in terms of microstructure, roughness, infrared specular reflectivity of layers, texture and stress formation by SEM, profilometer, FTIR, parallel beam XRD and deposit stress analyzer, respectively.

Subject Keywords

Electroforming, Reflective, Absorbing coating, Cupric oxide, Cuprous oxide, Shield

URI

https://hdl.handle.net/11511/32073

Journal

Advances in Materials and Processing Technologies

DOI

https://doi.org/10.1080/2374068x.2015.1127547

Collections

Graduate School of Social Sciences, Article

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Citation Formats

B. Arslan and İ. Karakaya, “Formation of gold plated electroformed copper structures,” Advances in Materials and Processing Technologies, pp. 384–393, 2016, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/32073.