Ahmet Cemal Durgun

E-mail
acdurgun@metu.edu.tr
Department
Department of Electrical and Electronics Engineering
Scopus Author ID
Web of Science Researcher ID
Low Loss Skip Layer Transmission Lines with Common Mode Filtering for Packages
Durgun, Ahmet Cemal; Aygun, Kemal (2022-01-01)
IEEETo address the increasing bandwidth demand in chip-to-chip communication, data rates of high-speed serial input/output interfaces have been aggressively increasing, which tightens the available packaging electrical bud...
Dual sided high frequency measurement of microelectronic packages
Christ, Sean R.; Durgun, Ahmet Cemal; Aygun, Kemal; Hill, Michael J. (2020-10-01)
© 2020 IEEE.Traditionally, validation of simulation data of microelectronic packages has been done by high frequency measurement of coplanar transmission line structures. Although this metrology has matured over the years,...
Causal and Passive Parameterization of S-Parameters Using Neural Networks
Torun, Hakki Mert; Durgun, Ahmet Cemal; Aygun, Kemal; Swaminathan, Madhavan (Institute of Electrical and Electronics Engineers (IEEE), 2020-10-01)
Neural networks (NNs) are widely used to create parametric models of S-parameters for various components in electronic systems. The focus of deriving these models has so far been numerical error reduction between the NN-ge...
Enforcing Causality and Passivity of Neural Network Models of Broadband S-Parameters
Torun, Hakki M.; Durgun, Ahmet Cemal; Aygun, Kemal; Swaminathan, Madhavan (2019-10-01)
© 2019 IEEE.This paper proposes a method to ensure that S-Parameters generated using neural network (NN) models are physically consistent and can be safely used in subsequent time-domain simulations. This is achieved by in...
Electrical Performance Limits of Fine Pitch Interconnects for Heterogeneous Integration
Durgun, Ahmet Cemal; Aygun, Kemal; Mahajan, Ravi; Hoang, Tim Tri; Shumarayev, Sergey Yuryevich (2019-01-01)
Heterogeneous integration facilitates faster design cycles with optimal functional IP module and silicon node combinations, but requires ultra-high bandwidth for the die-to-die communications. Fine pitch interconnects can ...
Design of Low-loss Transmission Lines with Common Mode Suppression for Packages
Durgun, Ahmet Cemal (2018-01-01)
Increasing data rates of high speed serial interfaces forces the insertion loss and common mode (CM) noise requirements to be tighter. This paper addresses both of these challenges by introducing a new low-loss transmissio...
Wearable Flexible Reconfigurable Antenna Integrated With Artificial Magnetic Conductor
Saeed, Saud M.; Balanis, Constantine A.; Birtcher, Craig R.; Durgun, Ahmet Cemal; Shaman, Hussein N. (2017-01-01)
This letter presents a wearable flexible reconfigurable folded slot antenna. The antenna is composed of a folded slot and a stub where the reconfigurability is achieved by turning a p-i-n diode ON and OFF, which alters the...
Reflection Phase and Surface Wave Propagation Characteristics of a Symmetrical Perforated High Impedance Surface
Saeed, Saud M.; Balanis, Constantine A.; Durgun, Ahmet Cemal (2016-01-01)
Electromagnetic bandgap (EBG) structures are used to suppress surface wave (SW) propagation in printed antenna systems. Although there are several different types of EBG structures, not all of them can be utilized in flexi...
Fiber Weave Impact on Crosstalk of High Speed Communication Channels in Glass Epoxy Packages
Durgun, Ahmet Cemal (2016-01-01)
Some packaging technologies utilize glass epoxy substrates that are composed of glass fiber bundles and epoxy resin. Because of the different electrical properties of glass and resin, the signal traces can have some variab...
Impact of Fiber Weaves on 56 Gbps SerDes Interface in Glass Epoxy Packages
Durgun, Ahmet Cemal (2015-01-01)
Some package substrates are composed of glass fiber bundles and epoxy resin which have different electrical properties. These differences result in variations in characteristic impedance and propagation speeds, which may b...
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