Dual sided high frequency measurement of microelectronic packages

2020-10-01
Christ, Sean R.
Durgun, Ahmet Cemal
Aygun, Kemal
Hill, Michael J.
© 2020 IEEE.Traditionally, validation of simulation data of microelectronic packages has been done by high frequency measurement of coplanar transmission line structures. Although this metrology has matured over the years, it is not directly applicable to product packages since they also include vertical interconnects. To address this issue, we developed a dual-sided measurement metrology, by utilizing a special fixture design and employing short-open-load-reciprocal calibration to maintain measurement stability at high frequencies. Metrology capability analysis shows that there is minimal operator and environmental condition dependency and a very good correlation with simulations up to 40 GHz for differential transmission lines.
Citation Formats
S. R. Christ, A. C. Durgun, K. Aygun, and M. J. Hill, “Dual sided high frequency measurement of microelectronic packages,” 2020, Accessed: 00, 2021. [Online]. Available: https://hdl.handle.net/11511/69944.