Dual sided high frequency measurement of microelectronic packages

Date

2020-10-01

Author

Christ, Sean R.
Durgun, Ahmet Cemal
Aygun, Kemal
Hill, Michael J.

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This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

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© 2020 IEEE.Traditionally, validation of simulation data of microelectronic packages has been done by high frequency measurement of coplanar transmission line structures. Although this metrology has matured over the years, it is not directly applicable to product packages since they also include vertical interconnects. To address this issue, we developed a dual-sided measurement metrology, by utilizing a special fixture design and employing short-open-load-reciprocal calibration to maintain measurement stability at high frequencies. Metrology capability analysis shows that there is minimal operator and environmental condition dependency and a very good correlation with simulations up to 40 GHz for differential transmission lines.

URI

https://hdl.handle.net/11511/69944

DOI

https://doi.org/10.1109/epeps48591.2020.9231489

Collections

Department of Electrical and Electronics Engineering, Conference / Seminar

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Citation Formats

S. R. Christ, A. C. Durgun, K. Aygun, and M. J. Hill, “Dual sided high frequency measurement of microelectronic packages,” 2020, Accessed: 00, 2021. [Online]. Available: https://hdl.handle.net/11511/69944.