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Optimization of a heat sink with heterogeneous heat flux boundary condition

Turgut, Eren
Advancements in micro/nanotechnology along with the size reduction in avionics, raise the importance of microchannel heat sink utilization in the field of electronics cooling. The usage of conventional uniform pin fin arrays or microchannels in the presence of non-uniform heating conditions are not sufficient to overcome the occurrence of the hotspots. Consequently, significant temperature gradients take place at the surface to be cooled. In this study, the effects of some design parameters on the non-uniform pin fin clustering is investigated with numerical and statistical methods. Then, with response surface method, surrogate functions for thermal resistance and pressure drop are obtained as functions of design parameters which are fin diameter, pitch ratio, hotspot fin array length, fin height and fluid mass flow rate. The multi-objective genetic algorithm is preferred for minimization of the thermal resistance and pressure drop which are the objective functions of optimization study. The optimum solution is selected from the best solution set, by employing TOPSIS method (Technique for Order of Preference by Similarity to Ideal Solution). Finally, the selected optimum design is solved numerically and compared with the predicted results