Optimization of a heat sink with heterogeneous heat flux boundary condition

Turgut, Eren
Advancements in micro/nanotechnology along with the size reduction in avionics, raise the importance of microchannel heat sink utilization in the field of electronics cooling. The usage of conventional uniform pin fin arrays or microchannels in the presence of non-uniform heating conditions are not sufficient to overcome the occurrence of the hotspots. Consequently, significant temperature gradients take place at the surface to be cooled. In this study, the effects of some design parameters on the non-uniform pin fin clustering is investigated with numerical and statistical methods. Then, with response surface method, surrogate functions for thermal resistance and pressure drop are obtained as functions of design parameters which are fin diameter, pitch ratio, hotspot fin array length, fin height and fluid mass flow rate. The multi-objective genetic algorithm is preferred for minimization of the thermal resistance and pressure drop which are the objective functions of optimization study. The optimum solution is selected from the best solution set, by employing TOPSIS method (Technique for Order of Preference by Similarity to Ideal Solution). Finally, the selected optimum design is solved numerically and compared with the predicted results


Comparison of the thermal and pressure drop characteristics of a conventional fin block and partially metal foam embedded heat sinks
Ataer, Süleyman Kaancan; Yamalı, Cemil; Albayrak, Kahraman; Department of Mechanical Engineering (2014)
Despite the downsizing of the electronic components, the increase in the power consumption of the electronic components and correspondingly the rise in the loss of power that transforms into heat have given a momentum in the search for different cooling methods for thermal sinks by the thermal engineers. Excessively heated regions that form on the small areas where the heat generating components contact the heat sinks create a thermal resistance for the heat flow from the surface of the component to the cha...
Experimental comparison of fluid and thermal characteristics of microchannel and metal foam heat sinks
Ateş, Ahmet Muaz; Aksel, Mehmet Haluk; Sert, Cüneyt; Department of Mechanical Engineering (2011)
Doubling transistor count for every two years in a computer chip, transmitter and receiver (T/R) module of a phased-array antenna that demands higher power with smaller dimensions are all results of miniaturization in electronics packaging. These technologies nowadays depend on improvement of reliable high performance heat sink to perform in narrower volumes. Employing microchannels or open cell metal foam heat sinks are two recently developing promising methods of cooling high heat fluxes. Although recent ...
Modeling of multidimensional heat transfer in a rectangular grooved heat pipe /
Odabaşı, Gülnihal; Dursunkaya, Zafer; Department of Mechanical Engineering (2014)
Heat pipes are generally preferred for electronics cooling application due to large heat transfer capacity in spite of small size. Micro heat pipes use small channels, whose dimension is on the order of micrometers, to generate necessary capillary action maintaining fluid flow for heat pipe operation. In the present study a flat micro heat pipe with rectangular cross section is analyzed numerically. A simplified axial fluid flow model is utilized to find liquid-vapor interface shape variation along the heat...
Implementation of metal-based microchannel heat exchangers in a microrefrigeration cycle, and numerical and experimental investigation of surface roughness effects on flow boiling
Jafari Khousheh Mehr, Rahim; Okutucu Özyurt, Hanife Tuba; Ünver, Hakkı Özgür; Department of Mechanical Engineering (2015)
A microscale vapor compression refrigeration cycle has been constructed for possible application in the thermal management of compact electronic components. The micro-evaporator and micro-condenser components have been fabricated using wire electron discharge machining and micromilling, respectively. Three microevaporators have been manufactured with different surface roughness for the experimental and numerical investigation of roughness effect on nucleate flow boiling in microchannels. In the numerical pa...
Numerical Investigation on Cooling of Small form Factor Computer Cases
ORHAN, OMER EMRE; Tarı, İlker (2008-11-01)
In this study, cooling of small form factor computers is numerically investigated. The problem is a conjugate heat transfer problem in which ambient air is the final heat transfer medium. In modeling the problem, heat transfer using heat pipes running from the CPU to the heat exchanger in the back end of the chassis, forced convection inside the chassis, ventilation of the chassis air, conduction paths inside the chassis, and natural convection from the chassis walls to the ambient air are considered. The n...
Citation Formats
E. Turgut, “Optimization of a heat sink with heterogeneous heat flux boundary condition,” Thesis (M.S.) -- Graduate School of Natural and Applied Sciences. Mechanical Engineering., Middle East Technical University, 2019.