Show/Hide Menu
Hide/Show Apps
Logout
Türkçe
Türkçe
Search
Search
Login
Login
OpenMETU
OpenMETU
About
About
Open Science Policy
Open Science Policy
Open Access Guideline
Open Access Guideline
Postgraduate Thesis Guideline
Postgraduate Thesis Guideline
Communities & Collections
Communities & Collections
Help
Help
Frequently Asked Questions
Frequently Asked Questions
Guides
Guides
Thesis submission
Thesis submission
MS without thesis term project submission
MS without thesis term project submission
Publication submission with DOI
Publication submission with DOI
Publication submission
Publication submission
Supporting Information
Supporting Information
General Information
General Information
Copyright, Embargo and License
Copyright, Embargo and License
Contact us
Contact us
Comparison of the thermal and pressure drop characteristics of a conventional fin block and partially metal foam embedded heat sinks
Download
index.pdf
Date
2014
Author
Ataer, Süleyman Kaancan
Metadata
Show full item record
Item Usage Stats
260
views
174
downloads
Cite This
Despite the downsizing of the electronic components, the increase in the power consumption of the electronic components and correspondingly the rise in the loss of power that transforms into heat have given a momentum in the search for different cooling methods for thermal sinks by the thermal engineers. Excessively heated regions that form on the small areas where the heat generating components contact the heat sinks create a thermal resistance for the heat flow from the surface of the component to the chassis and trap the thermal energy. The reasons for the preference of the metal foam for this study are the suitability for the forced convection and the conduction heat transfer methods as well as having a large heat transfer surface area. In this research, metal foams with 4,8,16 pores/cm aluminium having 93% porosity and copper metal foam having 90% porosity that are integrated into a heat sink with a special geometry was designed and built. During the process of the experiments, the thermal resistances and the pressure losses of the metal foam integrated heat sinks were tested by applying different heat fluxes and different air speeds to the specimens. Differences in the thermal performances of the heat sinks were observed by enforcing the specially manufactured heaters. In the first part of test scenarios smaller heaters were contacted only to the top side of the metal foam embedded regions of the heat sink chassis. In the second part of test scenarios the entire top surface of heat sink was heated with longer type heaters. Within the scope of the experiments, the performances of the designed heat sinks were compared with specially produced fin block which is known as one of the commonly used cooling methods. Experimental results were compared with the results that were obtained from the CFD and interpreted accordingly. As a result, how much improvement could be achieved was revealed and recommendations were made for the future projects and applications in partial use of metal foam of thermal management. It was observed that partial metal foam utilization is more efficient than a conventional aluminum fin block in thermal management.
Subject Keywords
Metal foams.
,
Solder and soldering.
,
Heat sinks (Electronics).
,
Heat
URI
http://etd.lib.metu.edu.tr/upload/12618144/index.pdf
https://hdl.handle.net/11511/24180
Collections
Graduate School of Natural and Applied Sciences, Thesis
Suggestions
OpenMETU
Core
Optimization of a heat sink with heterogeneous heat flux boundary condition
Turgut, Eren; Güvenç Yazıcıoğlu, Almıla; Department of Mechanical Engineering (2019)
Advancements in micro/nanotechnology along with the size reduction in avionics, raise the importance of microchannel heat sink utilization in the field of electronics cooling. The usage of conventional uniform pin fin arrays or microchannels in the presence of non-uniform heating conditions are not sufficient to overcome the occurrence of the hotspots. Consequently, significant temperature gradients take place at the surface to be cooled. In this study, the effects of some design parameters on the non-unifo...
Investigation of flow and heat transfer behavior of integrated pin fin-aluminum foam heat sink
ŞAHİN, Yiğit Serkan; TOPRAK, Beytullah İsmet; SOLMAZ, İsmail; Bayer, Özgür (2023-01-01)
With the rapid development in the electronics industry, the thermal management of high power density elec-tronic products (HPDEPs) has become very important and requires innovative heat removal technologies. In this study, an integrated heat sink (IHS) fabricated by combining aluminum foam and pin-finned heat sink config-urations that are frequently used in the cooling of electronic products has been proposed as an effective solution for the thermal management of HPDEPs. The heat removal and pressure drop c...
Modeling of multidimensional heat transfer in a rectangular grooved heat pipe /
Odabaşı, Gülnihal; Dursunkaya, Zafer; Department of Mechanical Engineering (2014)
Heat pipes are generally preferred for electronics cooling application due to large heat transfer capacity in spite of small size. Micro heat pipes use small channels, whose dimension is on the order of micrometers, to generate necessary capillary action maintaining fluid flow for heat pipe operation. In the present study a flat micro heat pipe with rectangular cross section is analyzed numerically. A simplified axial fluid flow model is utilized to find liquid-vapor interface shape variation along the heat...
Performance analysis of grooved heat pipes using 3-D multi-channel thermal resistance network
Sezmen, Ramazan Aykut; Dursunkaya, Zafer; Çetin, Barbaros; Department of Mechanical Engineering (2021-9)
Heat pipes are phase change heat transfer devices that transfer high amounts of heat with low temperature differences compared to conventional cooling techniques due to their high thermal conductivity. Since heat pipes do not require any external power supply and not involve any moving parts, they are preferred for high reliability applications and in wide range of industrial applications from thermal management of electronics to space applications. Essentially, heat pipes use the advantage of occurring pha...
Implementation of metal-based microchannel heat exchangers in a microrefrigeration cycle, and numerical and experimental investigation of surface roughness effects on flow boiling
Jafari Khousheh Mehr, Rahim; Okutucu Özyurt, Hanife Tuba; Ünver, Hakkı Özgür; Department of Mechanical Engineering (2015)
A microscale vapor compression refrigeration cycle has been constructed for possible application in the thermal management of compact electronic components. The micro-evaporator and micro-condenser components have been fabricated using wire electron discharge machining and micromilling, respectively. Three microevaporators have been manufactured with different surface roughness for the experimental and numerical investigation of roughness effect on nucleate flow boiling in microchannels. In the numerical pa...
Citation Formats
IEEE
ACM
APA
CHICAGO
MLA
BibTeX
S. K. Ataer, “Comparison of the thermal and pressure drop characteristics of a conventional fin block and partially metal foam embedded heat sinks,” M.S. - Master of Science, Middle East Technical University, 2014.