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A Road Map For CFD Modelling Of Forced Cooled Packages
Date
2006-11-10
Author
OZTURK, Emre
Tarı, İlker
Metadata
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This work is licensed under a
Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License
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In this study, Computational Fluid Dynamics, which has taken its position in the thermal design of electronic packages, was used in order to draw a CFD road map for forced cooling conjugate heat transfer analyses in heat generating electronic systems. The main sources of error in CFD analyses arise from inappropriate numerical models including turbulence models, radiation modeling and discretization schemes, insufficient grid resolution, and lack of convergence. A complete computer chassis model with heat sinks and fans inside was created and parametric analyses were performed to compare the effects of different turbulence models, discretization schemes, mesh resolutions, convergence criteria, and radiative heat transfer. Two commercially available CFD software packages were used, Icepak™ for pre-processing, Fluent™ for solution and post-processing. The road map was applied to three different heat sinks modeled into the full chassis. Numerical results were compared with the available experimental data and they were in good agreement.
Subject Keywords
Thermal design
,
CPU cooling
,
CFD
,
Conjugate heat transfer
,
Forced convection
,
Road map
URI
https://hdl.handle.net/11511/48844
DOI
https://doi.org/10.1115/imece2006-14307
Collections
Department of Mechanical Engineering, Conference / Seminar
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BibTeX
E. OZTURK and İ. Tarı, “A Road Map For CFD Modelling Of Forced Cooled Packages,” 2006, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/48844.