Modeling of thin films and cover plates bonded to graded substrates

Date

2006-10-18

Author

GÜLER, MEHMET ALİ
Erdogan, Fazil
Dağ, Serkan

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In this study the contact problems for thin films and cover plates will be considered. In these problems the loading consists of any one or combination of stresses caused by uniform temperature changes and temperature excursions, far field mechanical loading, and residual stresses resulting from film processing or welding. The primary interest in this study is in examining stress concentrations or singularities near the film ends for the purpose of addressing the question of crack initiation and propagation in the substrate or along the interface. The underlying contact mechanics problem is formulated and solved analytically by reducing it to an integral equation.

Subject Keywords

Contact mechanics, Thin films, Friction, Functionally graded materials

URI

https://hdl.handle.net/11511/52857

Conference Name

9th International Conference on Multiscale and Functionally Graded Materials

Collections

Department of Mechanical Engineering, Conference / Seminar

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Citation Formats

M. A. GÜLER, F. Erdogan, and S. Dağ, “Modeling of thin films and cover plates bonded to graded substrates,” Oahu, HI, 2006, vol. 973, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/52857.