A parametric modeling study on distributed MEMS transmission lines

2004-10-14
Unlu, M
Topalli, K
Demir, S
Aydın Çivi, Hatice Özlem
Koc, S
Akın, Tayfun
This paper presents a parametric study of a new model for the distributed MEMS transmission line (DMTL) structures. In this new model, the MEMS bridges which are used as the loading elements of the DMTL structures are represented as low-impedance transmission lines, rather than a lumped CLR circuit. The model also includes LC networks at the transition points from the MEMS bridges to the unloaded parts of the DMTL which are simply high-impedance transmission lines. These LC networks are employed to model the effects of the impedance discontinuities. The accuracy of the model is verified with simulations and measurements on different types of DMTLs that are fabricated with an RF MEMS process based on electroforming on a glass substrate. The fabricated structures include DMTLs with various MEMS bridge heights (2, 3, 4, and 5 mum) and center conductor widths (74, 96, and 122 mum). The variations of the model parameters with respect to the bridge height and center conductor width are obtained with EM simulations. The measurement results of the fabricated devices at a bridge height of 5 mum are in good agreement with the model.
34th European Microwave Conference (EuMC)

Suggestions

New approach for modelling distributed MEMS transmission lines
Topalli, K; Unlu, M; Demir, S; Aydın Çivi, Hatice Özlem; Koc, S; Akın, Tayfun (2006-04-01)
The paper presents a new and more accurate model for the distributed MEMS transmission line (DMTL) structures. In this new model, the MEMS bridges that are used as the loading elements of the DMTL structures are represented as low-impedance transmission lines, rather than a lumped CLR circuit. The model also includes LC networks at the transition points from the MEMS bridges to the unloaded parts of the DMTL, which are simply high-impedance transmission lines. These LC networks are employed to model the eff...
A new model for distributed mems transmission lines
Topalli, K; Unlu, M; Sagkol, H; Demir, S; Aydın Çivi, Hatice Özlem; Koc, S; Akın, Tayfun (2004-06-26)
This paper presents a new model for the distributed MEMS transmission line (DMTL) structure where the MEMS bridges that are placed periodically on a high-impedance transmission line are represented as low-impedance transmission lines, rather than a lumped CLR circuit. The model includes LC networks at the transition point from high-impedance to low-impedance lines to account for the effects of discontinuity. The accuracy of the model is verified with measurements on three types of DMTLs that are fabricated ...
A fabrication process based on structural layer formation using Au-Au thermocompression bonding for RF MEMS capacitive switches and their performance
Cetintepe, Cagri; Topalli, Ebru Sagiroglu; Demir, Şimşek; Aydın Çivi, Hatice Özlem; Akın, Tayfun (2014-10-01)
This paper presents a radio frequency micro-electro-mechanical-systems (RF MEMS) fabrication process based on a stacked structural layer and Au-Au thermocompression bonding, and reports on the performance of a sample RF MEMS switch design implemented with this process. The structural layer consists of 0.1 mu m SiO2/0.2 mu m SixNy/1 mu m Cr-Au layers with a tensile stress less than 50 MPa deposited on a silicon handle wafer. The stacked layer is bonded to a base wafer where the transmission lines and the iso...
A Detailed Analysis for the Absorption Coefficient of Multilevel Uncooled Infrared Detectors
Küçük, Serhat; Akın, Tayfun (2011-04-29)
This paper introduces a detailed analysis on the calculation of the absorption coefficient of multilevel uncooled infrared detectors. The analysis is carried out considering a two-level 25 mu m pixel pitch infrared detector with a sandwich type resistor which is divided into sub-regions consisting of different stacks of layers. The absorption coefficients of these different sub-regions are calculated individually by using the cascaded transmission line model, including the main body, arms, and the regions w...
A variational multiscale constitutive model for nanocrystalline materials
Gürses, Ercan (Elsevier BV, 2011-03-01)
This paper presents a variational multi-scale constitutive model in the finite deformation regime capable of capturing the mechanical behavior of nanocrystalline (nc) fcc metals. The nc-material is modeled as a two-phase material consisting of a grain interior phase and a grain boundary effected zone (GBAZ). A rate-independent isotropic porous plasticity model is employed to describe the GBAZ, whereas a crystal-plasticity model which accounts for the transition from partial dislocation to full dislocation m...
Citation Formats
M. Unlu, K. Topalli, S. Demir, H. Ö. Aydın Çivi, S. Koc, and T. Akın, “A parametric modeling study on distributed MEMS transmission lines,” presented at the 34th European Microwave Conference (EuMC), Amsterdam, The Netherlands, 2004, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/52980.