Mesoscopic nonequilibrium thermodynamics treatment of the grain boundary thermal grooving induced by the anisotropic surface drift diffusion

Date

2011-09-01

Author

Akyildiz, Oncu
ÖREN, ERSİN EMRE
Ogurtani, Tarik Omer

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A systematic study based on the self-consistent dynamical simulations is presented for the grain boundary thermal grooving problem by strictly following the irreversible thermodynamic theory of surfaces and interfaces with singularities [T. O. Ogurtani, J. Chem. Phys. 124, 144706 (2006)]. This approach furnishes us to have auto-control on the otherwise free-motion of the grain boundary triple junction without presuming any equilibrium dihedral (wetting) angles at the edges. The effects of physicochemical properties and the anisotropic surface diffusivity on the transient grooving behavior, which takes place at the early stage of the scenario, were considered. We analyzed the experimental thermal grooving data reported for tungsten in the literature, and compared them with the carried simulation results. This investigation showed that the observed changes in the dihedral angles are strictly connected to the transient behavior of the simulated global system, and manifest themselves at the early stage of the thermal grooving phenomenon.

Subject Keywords

Electromigration forces, Metallic interconnects, Electric-field, Crack-growth, Capillary, Interfaces

URI

https://hdl.handle.net/11511/66784

Collections

Department of Metallurgical and Materials Engineering, Article