Investigation of solder materials and bond formation for wafer level packaging of mems devices

Temel, Oğuzhan
MEMS devices are microscale systems which are fabricated using micro fabrication techniques. MEMS systems suggest many different functional devices for both military applications and consumer products. The packaging of MEMS devices is one of the most challenging parts of MEMS commercialization. Each type of MEMS device may need special operation environment. Therefore, the packaging of MEMS devices must provide required hermeticity in order to keep the special environment throughout the device's lifetime. Also another aspect of the production of MEMS devices is the miniaturization of the devices. The die level packaging of the MEMS devices is very costly. The use of wafer-level-packaging (WLP) processes enables the packaging of the devices with a single bonding process before the wafer is diced to have individual devices. In this thesis work materials and material systems and processes which enables the wafer level packaging of MEMS devices will be investigated.


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Branchline couplers are widely used components in the design of microwave devices. In addition to other applications, these couplers have been crucial elements for high power GaN based MMIC designs where layout space limitations are known to be critical. The conventional branchline couplers designed by four quarter wavelenght transmission lines. This type of conventional branchline coupler covers a large physical area that leads to high costs in MMIC fabrication. Therefore, design of miniaturized branchline...
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Indium tin oxide (ITO) thin films have been used as transparent electrodes in many technological applications such as display panels, solar cells, touch screens and electrochromic devices. Commercial grade ITO thin films are usually deposited by sputtering. Solution-based coating methods, such as sol-gel however, can be simple and economic alternative method for obtaining oxide films and also ITO. In this thesis, “ITO sols” and “ITO nanoparticle-incorporated hybrid ITO coating sols” were prepared using indi...
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Citation Formats
O. Temel, “Investigation of solder materials and bond formation for wafer level packaging of mems devices,” Ph.D. - Doctoral Program, Middle East Technical University, 2020.