Show/Hide Menu
Hide/Show Apps
Logout
Türkçe
Türkçe
Search
Search
Login
Login
OpenMETU
OpenMETU
About
About
Open Science Policy
Open Science Policy
Open Access Guideline
Open Access Guideline
Postgraduate Thesis Guideline
Postgraduate Thesis Guideline
Communities & Collections
Communities & Collections
Help
Help
Frequently Asked Questions
Frequently Asked Questions
Guides
Guides
Thesis submission
Thesis submission
MS without thesis term project submission
MS without thesis term project submission
Publication submission with DOI
Publication submission with DOI
Publication submission
Publication submission
Supporting Information
Supporting Information
General Information
General Information
Copyright, Embargo and License
Copyright, Embargo and License
Contact us
Contact us
Method of wafer-level hermetic packaging with vertical feedthroughs
Date
2017
Author
Alper, Said Emre
Torunbalcı, Mustafa Mert
Akın, Tayfun
Metadata
Show full item record
Item Usage Stats
276
views
0
downloads
Cite This
A wafer-level packaging method for MEMS structures that are desired to be encapsulated in a hermetic cavity and that need the transfer of at least a single or multiple electrical leads to the outside of the cavity without destroying the hermeticity of the cavity. Lead transfer is achieved using vertical feedthroughs that are patterned on the capping substrate within the same fabrication step to produce the encapsulating cavity. Furthermore, the structure of the vertical feedthroughs and via openings to reach these feedthroughs are arranged in such a way that conventional wirebonding would be sufficient to connect the vertical feedthroughs to the outer world, without a need for conductor-refill inside the via openings. The method is compatible with low-temperature thermocompression-based bonding/sealing processes using various sealing materials such as thin-film metals and alloys, and also with the silicon-glass anodic or silicon-silicon fusion bonding processes.
URI
https://hdl.handle.net/11511/70081
Collections
Department of Electrical and Electronics Engineering, Patent / Utility Model
Suggestions
OpenMETU
Core
Hermetic packaging method for SOI-MEMS devices with embedded vertical feedthroughs
Alper, Said Emre; Torunbalcı, Mustafa Mert; Akın, Tayfun (WIPO, 2016)
A wafer-level packaging method for SOI-MEMS structures that are desired to be encapsulated in a hermetic cavity with electrical leads to the outside without destroying the hermeticity of the cavity. The MEMS devices and vertical feedthroughs are both fabricated on the same SOI wafer, whereas a glass or silicon wafer is used for capping and routing metallization. The method requires at most five process masks and a single SOI wafer. Compared to the existing packaging technologies it reduces the number of waf...
Modeling of resin transfer molding for composites manufacturing
İpek, Hakan; Erdal Erdoğmuş, Merve; Department of Mechanical Engineering (2005)
The resin transfer molding (RTM ) process, in which a thermosetting resin is injected into a mold cavity preloaded with a porous fiber preform, is a manufacturing method for producing advanced continuous fiber reinforced composite products with complex geometries. Numerical simulation of resin transfer molding process is an often needed tool in manufacturing design, in order to analyze the process before the mold is constructed. In this study, a numerical simulation of the resin impregnation process in RTM ...
Design of a microbial sensor using conducting polymer of 4-(2,5-di(thiophen-2-yl)-1H-pyrrole-1-l) benzenamine
Tuncagil, Sevinc; ODACI DEMİRKOL, DİLEK; Yidiz, Ersin; TİMUR, SUNA; Toppare, Levent Kamil (Elsevier BV, 2009-03-28)
A microbial biosensor based on Gluconobacter oxydans cells immobilized on the conducting polymer of 4-(2,5-di(thiophen-2-yl)-1H-pyrrol-1-yl)benzenamine (SNS-NH2) coated onto the Surface of graphite electrode was constructed. The proposed biosensor was characterized using glucose as the Substrate. The linear relation was observed in the range of 0.1-2.5 mM and defined by the equation y = 0.415x + 0.377 (R-2 = 0.986). Analytical characterization, effects of electropolymerization time, pH, cell amount and the ...
Effect of Microfiber Reinforcement on the Morphology, Electrical, and Mechanical Properties of the Polyethylene/Poly(ethylene terephthalate)/Carbon Nanotube Composites
Yesil, Sertan; Koysuren, Ozcan; Bayram, Göknur (Wiley, 2010-11-01)
In situ microfiber reinforced conductive polymer composites consisting of high-density polyethylene (HDPE), poly(ethylene terephthalate) (PET), and multiwalled carbon nanotube (CNT) were prepared in a twin screw extruder followed by hot stretching of PET/CNT phase in HDPE matrix. For comparison purposes, the HDPE/PET blends and HDPE/PET/CNT composites were also produced without hot stretching. Extrusion process parameters, hot-stretching speed, and CNT amount in the composites were kept constant during the ...
Development of wafer-level vacuum packaging for MEMS devices with transient liquid phase (TLP) bonding: a combinatorial approach
Yurdakul, Özgün; Kalay, Yunus Eren; Department of Metallurgical and Materials Engineering (2023-1-25)
Electronic systems may be sealed by slicing the wafer into individual circuits and then packaging them or by packaging an integrated circuit while still part of the wafer. The latter enables the packaging of all detectors on complementary metal oxide semiconductors (CMOS) simultaneously, considerably decreasing manufacturing costs and increasing efficiency. Regarding a suitable packaging process for microbolometers, the most crucial parameter appears to be the compatibility of the packaging procedure with t...
Citation Formats
IEEE
ACM
APA
CHICAGO
MLA
BibTeX
S. E. Alper, M. M. Torunbalcı, and T. Akın, “Method of wafer-level hermetic packaging with vertical feedthroughs,” 00, 2017.
