Wafer Level Au Sn TLP Bonding from Eutectic Composition

Date

2016-02-14

Author

Yılmaz, Serkan
Temel, Oğuzhan
Akın, Tayfun
Kalay, Yunus Eren

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https://hdl.handle.net/11511/77972

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Wafer-Level Low-Temperature Solid-Liquid Inter-Diffusion Bonding With Thin Au-Sn Layers for MEMS Encapsulation Temel, Oguzhan; Kalay, Yunus Eren; Akın, Tayfun (Institute of Electrical and Electronics Engineers (IEEE), 2020-01-01) IEEEA novel solid-liquid inter-diffusion (SLID) bonding process is developed allowing to use thin layers of the Au-Sn material in wafer-level microelectromechanical systems (MEMS) packaging while providing a good bonding strength. The bond material layers are designed to have a robust bond material configuration and a metallic bond with a high re-melting temperature, which is an important advantage of SLID bonding or with its alternative name, transient liquid phase (TLP) bonding. The liquid phase in SLID b...
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Citation Formats

S. Yılmaz, O. Temel, T. Akın, and Y. E. Kalay, “Wafer Level Au Sn TLP Bonding from Eutectic Composition,” 2016, Accessed: 00, 2021. [Online]. Available: https://hdl.handle.net/11511/77972.