Wafer-Level Low-Temperature Solid-Liquid Inter-Diffusion Bonding With Thin Au-Sn Layers for MEMS Encapsulation

Date

2020-01-01

Author

Temel, Oguzhan
Kalay, Yunus Eren
Akın, Tayfun

Metadata

Show full item record

This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

Item Usage Stats

133
views

0
downloads

IEEEA novel solid-liquid inter-diffusion (SLID) bonding process is developed allowing to use thin layers of the Au-Sn material in wafer-level microelectromechanical systems (MEMS) packaging while providing a good bonding strength. The bond material layers are designed to have a robust bond material configuration and a metallic bond with a high re-melting temperature, which is an important advantage of SLID bonding or with its alternative name, transient liquid phase (TLP) bonding. The liquid phase in SLID bonding is the gold-rich eutectic liquid of the Au-Sn material system, where the bonding temperature is selected to be 320 °C for a reliable bonding. The average shear strength of the bonds is measured to be 38± 1.8 MPa. The hermeticity of the package is tested with the He-Leak test according to MIL-STD 883, which yields a leak value lower than 0.1 x 10⁻⁹ atm.cm³/s. The vacuum inside the package without a getter is calculated as 2.5 mbar after cap wafer thinning. The vacuum level is well preserved after post-processes such as annealing at 400 °C and the dicing process. These results verify that thin layers of Au-Sn materials can be used reliably with the SLID or TLP bonding technique using the new approach proposed in this study. [2020-0353]

Subject Keywords

Mechanical Engineering, Electrical and Electronic Engineering

URI

https://hdl.handle.net/11511/69980

Journal

Journal of Microelectromechanical Systems

DOI

https://doi.org/10.1109/jmems.2020.3040039

Collections

Department of Metallurgical and Materials Engineering, Article

Suggestions

OpenMETU
Core

Modeling and simulation of oil leakage in radial lip seals Yıldız, Meltem; Akkök, Metin; Department of Mechanical Engineering (2010) Radial lip seals are used to prevent leakage between machine elements in many industrial applications. During operation, fluid film between seal lip and shaft surface generates a pressure distribution on the lip which is elastically deformed due to hydrodynamic pressure. Surface roughness parameters in terms of moments of height profile distribution (rms roughness, skewness and kurtosis) affect the rate of oil leakage. A computer program is developed for elastohydrodynamic analysis of radial lip seals. Both...
A method for wafer level hermetic packaging of SOI-MEMS devices with embedded vertical feedthroughs using advanced MEMS process Torunbalci, Mustafa Mert; Alper, Said Emre; Akın, Tayfun (IOP Publishing, 2015-12-01) This paper presents a novel, inherently simple, and low-cost fabrication and hermetic packaging method developed for SOI-MEMS devices, where a single SOI wafer is used for the fabrication of MEMS structures as well as vertical feedthroughs, while a single glass cap wafer is used for hermetic encapsulation and routing metallization. Hermetic encapsulation can be achieved either with the silicon-glass anodic or Au-Si eutectic bonding techniques. The dies sealed with anodic and Au-Si eutectic bonding provide a...
Spatio-temporal development of surface charges on spacers stressed with DC voltages Bektas, S.I. (Institute of Electrical and Electronics Engineers (IEEE), 1990-6) The development of surface charge on a right-cylindrical spacer under different DC stress levels is measured in SF/sub 6/ for several hours. The DC voltage stress levels are below the stresses where partial discharges with AC voltage generally occur. The measurements indicate that charges are mainly deposited on one side only of the spacer and are predominantly of opposite polarity to that of the applied voltage. The charge and its area increase with time and saturate. Typical saturation times are approxima...
Modeling of resin transfer molding for composites manufacturing İpek, Hakan; Erdal Erdoğmuş, Merve; Department of Mechanical Engineering (2005) The resin transfer molding (RTM ) process, in which a thermosetting resin is injected into a mold cavity preloaded with a porous fiber preform, is a manufacturing method for producing advanced continuous fiber reinforced composite products with complex geometries. Numerical simulation of resin transfer molding process is an often needed tool in manufacturing design, in order to analyze the process before the mold is constructed. In this study, a numerical simulation of the resin impregnation process in RTM ...
Conduction based compact thermal modeling for thermal analysis of electronic components Ocak, Mustafa; Sert, Cüneyt; Department of Mechanical Engineering (2010) Conduction based compact thermal modeling of DC/DC converters, which are electronic components commonly used in military applications, are investigated. Three carefully designed numerical case studies are carried out at component, board and system levels using ICEPAK software. Experiments are conducted to gather temperature data that can be used to study compact thermal models (CTMs) with different levels of simplification. In the first (component level) problem a series of conduction based CTMs are generat...

Citation Formats

O. Temel, Y. E. Kalay, and T. Akın, “Wafer-Level Low-Temperature Solid-Liquid Inter-Diffusion Bonding With Thin Au-Sn Layers for MEMS Encapsulation,” Journal of Microelectromechanical Systems, pp. 0–0, 2020, Accessed: 00, 2021. [Online]. Available: https://hdl.handle.net/11511/69980.