MULTI PHYSICS MODELING OF SILICON BASEDMICRO GROOVED HEAT PIPE

2015-05-28
Serdar, Taze
Çetin, Barbaros
Dursunkaya, Zafer
Heat pipes have the advantage of transferring large amounts of heat between reservoirs with small temperature differences which makes them preferable for electronics cooling applications. Micro-grooved heat pipes promise the additional advantage of being adaptable to systems which need to be cooled with minimal contact resistance. In this study, a multi-physics computational model is developed to assess the thermal performance of a silicon-based micro-grooved heat pipe. The microfluidic platform consists of 50 rectangular micro-grooves on a silicon wafer with integrated chromium (Cr) microheaters. The phase change occurring within the micro-groove is included in the model as a convective heat transfer boundary condition at the channel wall. The convective heat transfer coefficients are obtained from another detailed study in which the 3-D heat transfer process in the solid and working fluid coupled with a 1-D analysis of momentum equation in a unit cell is solved. With the current computational model, an experimental set-up is designed, which will be used as the verification tool of the detailed computational model for a unit cell. The required heating and cooling conditions of the unit cell model can be realized with the proper design of the heater and the cooling channels. The present study demonstrates that the thermal performance of MHP can be predicted with global multi-physics modeling integrated with rigorous phase change model based on a unit cell.
8th International Conference on Computational Heat and Mass Transfer, 2015

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Citation Formats
T. Serdar, B. Çetin, and Z. Dursunkaya, “MULTI PHYSICS MODELING OF SILICON BASEDMICRO GROOVED HEAT PIPE,” presented at the 8th International Conference on Computational Heat and Mass Transfer, 2015, Istanbul, Turkey, 2015, Accessed: 00, 2021. [Online]. Available: https://hdl.handle.net/11511/78905.