Micromechanically motivated inter-granular cracking in polycrystalline aggregates

th International Conference on Material Modelling, 26 - 28 June 2019


Micromechanically Motivated Modeling of Semicrystalline Polymers
Oktay, Hasan Emre; Gürses, Ercan; Göktepe, Serdar (2017-09-05)
Semicrystalline polymers (SCPs) are of ever increasing technological importance due to their remarkable toughness, good impact strength, very low gas-permeability, superior wear resistance, and biocompatibility. They have been used in applications such as ballistic plates, model aircraft, liquid and gas containers, plastic bags, piping systems, electrical insulation systems, substrates for flexible electronic devices, and joint implants. Owing to amorphous polymer chain networks and crystalline structures, ...
Micropatterning of Ferroelectric PB(Zr0.52Ti0.48)03 films using SOL-GEL processing
Gerçeker(Turhan), Nilgün; Özenbaş, Macit; Department of Metallurgical and Materials Engineering (2000)
Micromechanical Properties of Marginal Glass Forming Alloys
Kalay, İlkay; Uluca, Tolga Han; Özerinç, Sezer; Kalay, Yunus Eren (2021-02-23)
Micromechanical modeling of intrinsic and specimen size effects in microforming
Yalçınkaya, Tuncay; Simonovski, I (2018-09-01)
Size effect is a crucial phenomenon in the microforming processes of metallic alloys involving only limited amount of grains. At this scale intrinsic size effect arises due to the size of the grains and the specimen/statistical size effect occurs due to the number of grains where the properties of individual grains become decisive on the mechanical behavior of the material. This paper deals with the micromechanical modeling of the size dependent plastic response of polycrystalline metallic materials at micr...
Microfabrication of vacuum-sealed cavities with nanocrystalline and ultrananocrystalline diamond membranes and their characteristics
Bayram, Barış (Elsevier BV, 2011-08-01)
Vacuum-sealed cavities featuring diamond membranes are fabricated using plasma-activated direct bonding technology. A chemical mechanical polished (CMP) silicon dioxide interlayer, deposited on diamond with a high temperature oxide (HTO) process at 850 degrees C in a low pressure chemical vapor deposition (LPCVD) furnace, is employed for successful direct bonding and vacuum cavity formation. The circular cavities are defined on the thermally grown oxide of the phosphorus-doped Si wafer (4-in, < 100 >, 1.2 O...
Citation Formats
T. Yalçınkaya and İ. T. Tandoğan, “Micromechanically motivated inter-granular cracking in polycrystalline aggregates,” Lund, Sweden, 2019, vol. 1, Accessed: 00, 2021. [Online]. Available: https://hdl.handle.net/11511/79926.