A Case Study: Component placement sequencing of a turret style SMT machine

Date

2007-07-08

Author

Kandiller, Levent
Çengel, Savaş
Bayındır, Zeynep Pelin

Metadata

Show full item record

Item Usage Stats

142
views

0
downloads

A Case Study: Component placement sequencing of a turret style SMT machine Levent Kandiller, Cankaya University, Department of Industrial Engineering, Cankaya University, Ogretmenler ¨ Caddesi No: 14, 06530, Ankara, Turkey, kandiller@cankaya.edu.tr, Savas Cengel, Z. Pelin Bayindir The study aims to improve component placement sequencing of PCBs produced on a turret style SMT machine in a leading Turkish electronics company. Because of the concurrent (turret,table,feeder) nature of the machine movement, the sequencing problem is hard to solve optimally. We developed two heuristic approaches and two lower bounding schemes. The heuristic solutions are compared with optimal solutions for randomly generated PCBs, and with the lower bounds for real PCBs in the production line. Our method yielded a considerable improvement (27 %) as compared to the company’s method.

URI

https://hdl.handle.net/11511/83784

Collections

Unverified, Conference / Seminar

Suggestions

OpenMETU
Core

A case study : improvement of component placement sequence of a turret style smt machine Çengel, Mehmet Savaş; Kandiller, Levent; Department of Industrial Engineering (2006) This study aims to improve component placement sequencing of a number of PCBs produced on a turret style SMT machine. After modeling the problem and having found that an optimal solution to the real PCB problem is hard to be achieved because of the concurrent behavior of the machine and the PCB design parameters, two heuristics are developed by oversimplifying the problem down to TSP. Performance of the heuristics and the lower bounds is evaluated by comparing the results with the optimal solution for two s...
The performance of traditional lot sizing heuristics in a disassembly environment Bayındır, Zeynep Pelin (null; 2007-07-08) The performance of traditional lot sizing heuristics in a disassembly environment Z. Pelin Bayindir, Department of Industrial Engineering, Middle East Technical University, Middle East Technical University, Department of Industrial Engineering, 06531, Ankara, Turkey, bayindir@ie.metu.edu.tr, Tulu Ertem In this study we focus on a disassembly system where there are a number of end-of-life products (root) that can be disassembled to satisfy the demand for their child (leaf) items. The demand for the le...
A heuristic approach for profit-oriented disassembly scheduling problem Kaya Akça, Melike; Bayındır, Zeynep Pelin; Çetinkaya, Ferda Can (null; 2013-07-01) A heuristic approach for profit oriented disassembly sheduling problem Melike Kaya Akça, METU-Industrial Engineering Dept., Graduate School of Natural and Applied Sciences, Turkey, kamelike@metu.edu.tr, Z. Pelin Bayindir, Ferda Can Cetinkaya We consider a disassembly scheduling problem for multiple products with parts commonality and ample supply of discarded products. We propose a heuristic algorithm which is based on the idea of sequentially solving a relaxed ...
A Thermal and Electro-magnetic Hybrid MOEMS Microscanner with Integrated Spatial Light Modulation and Metalens for Resolution Enhancement of Infrared Imaging Systems Sozak, Ahmet; Simsek, Ertug; Yelboga, Tolga; Gungor, Alper; Balli, Fatih; Azgın, Kıvanç (2022-01-01) IEEEThis article describes the development of a novel integrated thermal and electro-magnetic hybrid micro opto-electro mechanical system (MOEMS) based scanning actuator. Determining the optical architecture and components used for scanning are significant points of the study. A metalens and a coded mask, both of which can be produced by micro fabrication methods, are used in the optical part of the actuator. In this context, a metalens consisting of nano-holes was designed and fabricated as the first alter...
A low-cost uncooled infrared detector array and its camera electronics Akçören, Dinçay; Akın, Tayfun; Eminoğlu, Selim; Department of Electrical and Electronics Engineering (2011) This thesis presents the development of integrated readout electronics for diode type microbolometers and development of external camera electronics for microbolometers. The developed readout electronics are fabricated with its integrated 160x120 resolution FPA (Focal Plane Array) in the XFAB SOI-CMOS 1.0 μm process. The pixels in the FPA have 70 μm pixel pitch, and they are sensitive in the 8–12 μm band of the infrared spectrum. Each pixel has 4 serially connected diodes, and diode turn on voltage changes ...

Citation Formats

L. Kandiller, S. Çengel, and Z. P. Bayındır, “A Case Study: Component placement sequencing of a turret style SMT machine,” 2007, Accessed: 00, 2021. [Online]. Available: https://hdl.handle.net/11511/83784.